Product Overview
This high-performance Electronic Encapsulation Adhesive includes addition curing and condensation curing types, serving as reliable industrial Silicone raw materials for RF power device packaging. It features exceptional adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. After curing, it forms a uniform void-free protective layer that absorbs thermal cycling stress, shields internal chips and gold bonding wires, and offers integrated insulation, waterproof, dustproof and anti-corrosion protection for power dividers in high-frequency operating environments.
Core Product Features & Advantages
Specially optimized for RF power divider working demands, it maintains precise power distribution balance superior to ordinary potting materials:
1. Precise power splitting stability: Consistent dielectric properties ensure balanced power distribution, zero power deviation and signal distortion during long-term high-frequency operation.
2. All-round environmental resistance: Boasts excellent waterproof, moisture-proof, shockproof and anti-corrosion performance, with strong resistance to ozone and chemical erosion.
3. Extreme temperature adaptability: Stably operates at -60℃ to 220℃, relieves high-temperature stress and maintains stable power dividing parameters under temperature cycling.
4. Low volatility & high bonding strength: Ultra-low volatile content and high mechanical strength, firmly bonds multiple materials without interfering with RF power transmission.
Application Scenarios
Ideal for encapsulation and sealing of RF power dividers, microwave power splitters, signal distribution modules and wireless RF devices. Widely applied in 5G communication systems, precision test instruments and aerospace electronic equipment. It stabilizes power dividing accuracy, reduces device failure rates, improves product consistency, and effectively cuts manufacturers’ production calibration and maintenance costs.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly to ensure uniform formulation.
2. Standard mixing: Strictly follow AB component weight ratio to guarantee stable RF dielectric and power balance performance.
3. Vacuum defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3-minute defoaming to avoid bubble-induced signal and power instability.
4. Curing treatment: Adopt room temperature or heating curing. Initial curing allows subsequent processing, with full curing completed within 24 hours.
Certifications & Compliance
Our products comply with ISO9001, CE, UL and ROHS international standards, meeting global RF electronic industry specifications and supporting cross-border export and high-end industrial applications.
Customization Options
Customized solutions are available. Viscosity, hardness, operating time and curing speed can be adjusted to adapt to different power divider packaging processes.
Production & Quality Control
We implement standardized production and full-process strict QC. Pre-production sample testing and pre-shipment inspection ensure stable RF performance and consistent batch quality.
FAQ
Q1: Will this Potting Compound affect power divider power balance? A: No. It features ultra-stable dielectric properties, maintaining accurate power splitting balance without signal attenuation or deviation. Q2: Can stratified silicone be used for power divider encapsulation? A: Slight stratification is normal after long storage. Even stirring will not affect its protective and RF stable performance.
Q3: How to store power divider potting silicone? A: Store in sealed and dry conditions. Mixed AB silicone should be used up at one time to prevent performance degradation.