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Home> Products> Electronic Potting Compound> Low Odor Electronic Potting Compound
Low Odor Electronic Potting Compound
Low Odor Electronic Potting Compound
Low Odor Electronic Potting Compound
Low Odor Electronic Potting Compound
Low Odor Electronic Potting Compound
Low Odor Electronic Potting Compound

Low Odor Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9325

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Product Description
HONG YE SILICONE’s Low Odor Electronic Potting Compound is an eco-friendly, safe encapsulation solution optimized for indoor and closed workshop production. As a mild fume protective encapsulation material and workplace friendly module Potting Compound, it features reduced volatile circuit board sealing performance. It maintains stable operation at -60℃ to 220℃, with ultra-low volatile content and zero pungent odor during mixing and curing. It integrates insulation, heat dissipation and anti-corrosion functions, ensuring both excellent electronic protection and a healthy working environment.
 
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Product Overview

Available in addition and condensation curing formulas, this low-volatile Electronic potting compound upgrades traditional potting materials’ odor defects. Serving as a safe Electronic Encapsulation Adhesive, it delivers excellent adhesion and tight sealing for PCB, PC, PMMA, CPU and multiple metal substrates. This eco Silicone Encapsulant retains professional heat dissipation performance of standard Thermally Conductive Potting Compound, balancing environmental safety and reliable circuit protection.

Technical Specifications

This workplace friendly module potting compound adopts low-odor formula technology with minimized volatile emissions and mild fume features. It boasts high structural strength, outstanding ozone and chemical erosion resistance, and can absorb thermal cycling internal stress to protect chips and bonding wires. It features stable physical and chemical properties, with customizable viscosity, hardness and operating time to fit diverse production environments.
 
electronic silicone

Product Features & Advantages

1. Eco-Friendly Low-Odor Performance: This mild fume protective encapsulation material produces no irritating smell during construction and curing, complying with workplace safety standards.
2. Reduced Volatile Emission: Realizes reduced volatile circuit board sealing, lowering air pollution and improving indoor production safety.
3. Workplace Friendly Design: The low-odor formula adapts to closed workshops and indoor assembly lines, greatly optimizing working conditions.
4. Comprehensive Stable Protection: Integrates waterproof, insulation, shockproof and high-low temperature resistance without sacrificing core protective performance.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir Part A evenly and shake Part B thoroughly to disperse functional fillers uniformly.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure complete and stable curing.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless sealing.
4. Standard Curing: Support room temperature or heating curing; full curing takes 24 hours to form a complete safe protective layer.

Application Scenarios

This low-odor potting compound is widely used for indoor consumer electronics, household electrical modules, closed industrial control equipment and medical electronic devices. It improves workshop environmental safety, meets eco-production requirements, reduces environmental compliance risks, and enhances product market competitiveness.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international environmental and safety standards, suitable for global eco-friendly electronic manufacturing.

Customization Options

We support personalized adjustment of hardness, viscosity and operating time to match different indoor and closed-environment encapsulation demands.

Production Process

We adopt dust-free standardized production and strict volatile and odor testing. Each batch is verified for low-odor and low-volatile performance to ensure consistent workplace-friendly quality.

FAQ

Q1: What is the biggest advantage of this potting compound?
A: It is a mild fume protective encapsulation material and workplace friendly module potting compound,
achieving safe reduced volatile circuit board sealing for indoor production.
Q2: Is it suitable for fully enclosed workshop production?
A: Yes. With ultra-low odor and volatile content, it causes no air pollution, perfectly adapting to closed
and indoor production scenarios.
Q3: Does colloidal stratification affect low-odor performance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and the low-odor and low-volatile
performance remain unchanged.
 
 
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