Key Features
Self-Adhesive Without Primer: Bonds directly to PC, PP, ABS, PVC and metal surfaces, saving processing steps and cost
Low Viscosity for Complete Coverage: Mixed viscosity as low as 600 cps flows into fine gaps and complex structures for void-free potting
Flexible Curing: Room temperature cure at 8 hours (25°C) or heat cure at 20 minutes (80°C) to match different production needs
High Dielectric Strength: No less than 25 kV/mm dielectric strength and no less than 1.0x10 to the 16th ohm-cm volume resistivity for reliable insulation
Thermal Conductivity: No less than 0.2 W/(m.K) helps dissipate heat from electronic components
Waterproof and Moisture-Proof: Cured gel forms a seamless barrier against water and humidity
Wide Temperature Range: Stable performance from -50°C to 200°C for demanding environments
UL94 V-1 Flame Retardant: Compliant with international electronic safety standards
Environmentally Friendly: RoHS compliant, passed UL, MSDS, REACH certifications
Available Models
Model: HY-9300, Hardness: 0 Shore A, Mixed Viscosity: 600-1000 cps, Operating Time: 30-60 min (25°C), Curing Time: 8h (25°C), Application: Self-adhesive transparent potting, reworkable encapsulation
Model: HY-9400, Hardness: Less than 0 Shore A, Mixed Viscosity: 680-1400 cps, Operating Time: 40-60 min (25°C), Curing Time: 3-5h (25°C), Application: Ultra-soft gel for deep layer potting and shock absorption
Model: HY-9405, Hardness: 5 plus or minus 2 Shore A, Mixed Viscosity: 600-1000 cps, Operating Time: 1-3h (25°C), Curing Time: 8h (25°C), Application: General electronic potting, structural support encapsulation
Custom formulations available upon request. Hardness, viscosity, operating time, curing speed and color can all be tailored.
How to Use
1.Stir component A and B separately before mixing
2.Weigh A and B at 1:1 ratio by weight
3.Mix thoroughly until homogeneous
4.Vacuum degas at -0.08 MPa for 3-5 minutes
5.Pour into the target component
6.Cure at room temperature or accelerate with heat (80-100°C)
Applications
Electronic component insulation potting
Power module encapsulation and protection
PCB board sealing against moisture and dust
LED module potting and waterproofing
Sensor and probe encapsulation
Cable joint and connector sealing
Transformer and inductor potting
Underwater and marine electronics protection
Automotive electronic module encapsulation
Medical device component insulation
Packing and Delivery
Standard: 20kg/set (Component A 10kg + Component B 10kg)
Bulk: 200kg drum available
Custom packaging upon request
Non-dangerous goods for transport
Store below 25°C, shelf life 12 months
Why Choose Hong Ye Silicone
25+ years of silicone R&D and manufacturing experience
ISO9001 certified quality management system
Dedicated R&D team for custom formulations
Exported to 138+ countries worldwide
Free samples available for testing
Full technical support and after-sales service
FAQ
Q: Can the product cure at room temperature?
A: Yes. At 25°C, it cures fully in about 8 hours. For faster production, heat cure at 80-100°C takes only 20 minutes.
Q: Does it bond to surfaces without primer?
A: Yes. The self-adhesive formula bonds directly to PC, PP, ABS, PVC and common metals without any primer.
Q: Can you customize hardness and viscosity?
A: Yes. We offer custom formulations where hardness, viscosity, operating time, curing speed and color can all be adjusted to your requirements.
Q: What is the minimum order quantity?
A: Standard MOQ is 20kg (1 set). Sample orders from 1kg are also accepted for testing.
Q: Is the product environmentally compliant?
A: Yes. All HY-9 Series products are RoHS compliant and have passed UL, MSDS, REACH and ISO9001 certifications.
Shenzhen Hong Ye Jie Technology Co., Ltd
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