Two Component Silicone Potting Compound for Transformer and Power Supply Encapsulation

Two Component Silicone Potting Compound for Transformer and Power Supply Encapsulation

Name: electronic potting compound-4
Uploaded: 2026-02-26T07:41:27+08:00
Description: Product Description Hong Ye Silicone HY-9 Series is a two-component addition-cure potting compound engineered for

$10-12 /

Min. Order:

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Product Description

Packaging & Delivery

Product Description

Packaging & Delivery

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electronic potting compound-4

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Product Description

Hong Ye Silicone HY-9 Series is a two-component addition-cure Potting Compound engineered for transformer encapsulation, power supply module protection and industrial electronics sealing. Its low viscosity and self-adhesive formula ensure complete void-free filling around coil windings and complex internal structures.

Key Features

Self-Adhesive Without Primer: Bonds directly to metal cores, coil windings, PCB substrates and plastic housings, eliminating primer processing steps

Ultra-Low Viscosity: Penetrates deep into coil gaps and tight spaces around transformer windings for thorough encapsulation

High Dielectric Strength: 25 kV/mm minimum provides reliable insulation for high-voltage transformer applications

Thermal Management: Thermal conductivity 0.2 W/(m.K) minimum helps dissipate heat generated by power components

1:1 Simple Mixing: Weight-based ratio reduces measurement errors and ensures consistent curing quality

Flexible Cure Schedule: Room temperature 8 hours or rapid heat cure 20 minutes at 80C to match production pace

UL94 V-1 Flame Retardant: Meets international safety requirements for power and industrial electronics

Wide Temperature Range: Performs from -50C to 200C, suitable for automotive and outdoor power equipment

Stir component A and B separately before mixing

Weigh A and B at 1:1 by weight

Mix thoroughly until fully homogeneous

Vacuum degas at -0.08 MPa for 3-5 minutes

Pour slowly into transformer or module housing

Cure at room temperature or accelerate with heat at 80-100C

Applications

Transformer and inductor potting and insulation

Switching power supply module encapsulation

Adapter and charger potting protection

Inverter and converter sealing

Industrial controller moisture-proof potting

Automotive electronic control unit encapsulation

LED driver potting and waterproof protection

Sensor and probe potting for harsh environments

Packing and Delivery

Standard: 20kg/set (Component A 10kg + Component B 10kg)

Sample: 1kg available for testing

Bulk: 200kg drum available

Non-dangerous goods for easy shipping

Store at 25C or below, shelf life 12 months

FAQ

Q: Can this potting compound withstand high voltage?
A: Yes. The dielectric strength reaches 25 kV/mm minimum, providing reliable insulation for high-voltage transformer and power module applications.

Q: How do I handle air trapped in transformer windings?
A: After mixing, vacuum degas at -0.08 MPa for 3-5 minutes before pouring. The low viscosity helps the silicone flow into coil gaps and release trapped air naturally.

Q: What if I need faster curing for mass production?
A: Heat cure at 80-100C reduces curing time to approximately 20 minutes, ideal for high-volume production lines.

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