Product Overview
This two-component routine-grade silicone potting material includes addition and condensation curing formulas, designed for daily and universal electronic encapsulation. It meets the basic and routine encapsulation needs of most general electronic products with stable and cost-effective performance. It provides excellent encapsulation, sealing and filling protection for electronic components, with superior adhesion and thermal stability on PCB, CPU, PC, PMMA and various metal substrates, suitable for wide-ranging routine electronic packaging scenarios.
Technical Specifications
This general circuit sealing silicone features balanced basic performance and stable adaptability for routine encapsulation processes. It boasts outstanding corrosion resistance, ozone resistance and chemical stability. It maintains stable waterproof, dustproof, insulating and shockproof performance in general working environments, with low volatility and strong bonding force. Viscosity, curing hardness and operating time support full personalized customization.
Product Features & Advantages
1. Routine Reliable Performance: This standard use protective encapsulation material provides stable and consistent protection for daily electronic encapsulation needs.
2. Cost-Effective Daily Use: The everyday module potting compound offers practical protection at a reasonable cost, ideal for mass routine electronic production.
3. All-Round Environmental Stability: Resists wide temperature fluctuations and daily harsh environments, ensuring long-term reliable circuit protection.
4. High Purity & Easy Operation: Low volatile content avoids component contamination, while simple operation reduces daily production difficulty and cost.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to retain stable routine-grade performance.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes to eliminate bubbles for uniform encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, with complete routine protection fully formed after curing.
Application Scenarios & Commercial Value
Ideal for general industrial control modules, consumer electronics, LED lighting equipment and most routine electronic products. Its cost-effective and stable performance reduces daily material procurement costs, simplifies production processes, improves product qualification rate, and lowers long-term maintenance and replacement costs for electronic manufacturers.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global routine electronic manufacturing safety and environmental specifications.
Customization Options
We support personalized customization of viscosity, curing hardness and operating time to adapt to diverse routine encapsulation processes.
Production Process
Adopting standard routine-grade formula and standardized dust-free production, each batch undergoes strict basic performance tests to ensure consistent premium protective quality.
FAQ
Q1: What is the core advantage of routine-grade potting silicone?
A: It is an everyday module potting compound with stable performance and high cost-effectiveness
for routine electronic encapsulation.
Q2: Is it suitable for mass production of routine electronic products?
A: Yes. This standard use protective encapsulation material features easy operation and stable
performance, fitting mass routine production perfectly.
Q3: Does colloidal stratification affect routine-grade performance?
A: No. Stir evenly before use, and it can fully restore stable performance and general circuit
sealing effect.