Product Overview
This two-component Max Shield encapsulant includes addition and condensation curing formulas. As a high-performance electronic protective material, it cures steadily after mixing with curing agents to complete encapsulation, sealing, filling and pressure resistance. It integrates waterproof, flame-retardant, dustproof and insulating functions, featuring excellent adhesion and thermal stability on PCB, CPU, PC and PMMA substrates for long-term reliable electronic module protection.
Technical Specifications
This salt spray proof resin adopts low-volatility, high-strength premium formula. It delivers superior arc resistance and insulation performance, with excellent ozone and chemical erosion resistance. As a low stress elastomer sealant, it gently absorbs thermal cycling internal stress, effectively protecting chips and gold bonding wires. It provides stable adhesion on aluminum, copper and stainless steel, with customizable viscosity, curing hardness and operating time.
Product Features & Advantages
1. Max-Level Barrier Protection: This arc resistant insulation gel provides all-round defense against salt spray, corrosion, high voltage and extreme temperatures.
2. Low-Stress Protection Design: Flexible elastomer structure relieves thermal expansion stress, avoiding component damage during long-term temperature cycling.
3. Ultra-Strong Environmental Adaptability: Stable performance from -60℃ to 220℃ adapts to harsh indoor and outdoor working environments.
4. High Purity & Durable Bonding: Low volatile content prevents circuit contamination, while excellent metal and substrate adhesion ensures long-term tight sealing.
Step-by-Step Application Process
1. Pre-Mixing Preparation: Fully stir component A to homogenize settled fillers and shake component B thoroughly before use.
2. Precise Proportioning: Mix A and B components strictly in standard weight ratio to ensure complete and uniform curing.
3. Vacuum Defoaming: Place mixed colloid in a 0.01MPa vacuum container for 3 minutes defoaming to eliminate tiny bubbles.
4. Standard Curing: Cure at room temperature or heating status; full curing takes 24 hours, affected by ambient temperature and humidity.
Application Scenarios & Commercial Value
Ideal for outdoor LED equipment, marine electronic modules and high-voltage precision control devices. This Max Shield encapsulant resists harsh environmental erosion, reduces electronic failure rates, extends equipment service life, cuts long-term maintenance and replacement costs, and improves manufacturers’ product stability and market competitiveness.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global high-standard electronic manufacturing safety and environmental specifications.
Customization Options
Customizable curing hardness, colloid viscosity and operating time are available to meet personalized high-demand electronic encapsulation requirements.
Production Process
Adopting dust-free refined production and strict batch performance testing, every batch of low stress elastomer sealant undergoes full inspection to ensure consistent max-level protective quality.
FAQ
Q1: What makes Max Shield different from ordinary potting silicone?
A: It features professional arc resistance and salt spray resistance, plus low-stress flexible protection,
perfectly for harsh and high-standard electronic scenarios.
Q2: Can stratified colloid after storage be used normally?
A: Yes. Even stirring before use can fully restore original max protection performance without any
quality impact.
Q3: Is it suitable for long-term outdoor and marine electronics?
A: Absolutely. This salt spray proof resin resists humidity and salt corrosion, ideal for long-term
outdoor and marine electronic equipment protection.