Product Overview
This two-component commercial-grade potting compound provides addition and condensation curing options. As a mainstream commercial electronic protection material, it cures rapidly after mixing with curing agents to finish encapsulation, sealing, filling and pressure resistance. It integrates waterproof, moisture-proof, insulating and heat-dissipating performance, with excellent adhesion and thermal stability on PCB, CPU, PC and PMMA, ideal for mass commercial electronic production.
Technical Specifications
This commercial standard insulating sealant resin features low volatile content and balanced structural strength. It resists corrosion, ozone and chemical erosion effectively. It stably operates at -60℃ to 220℃, absorbing internal thermal cycling stress to protect chips and gold bonding wires. It offers outstanding adhesion on aluminum, copper and stainless steel, with customizable viscosity, curing hardness and working time for commercial production demands.
Product Features & Advantages
1. Balanced Commercial-Grade Performance: This business use protective encapsulant material integrates dustproof, shockproof and temperature-resistant functions to meet daily commercial electronic protection standards.
2. Wide Environmental Adaptability: It maintains stable sealing and insulating performance in variable temperature and humidity environments for long-term commercial equipment operation.
3. Multi-Substrate Compatibility: The commercial potting silicone gel compound fits most common circuit boards and metal materials with strong and durable bonding force.
4. High Cost-Performance: Stable quality with low contamination risk, perfectly suited for large-batch commercial electronic manufacturing to control production costs.
Step-by-Step Application Process
1. Pre-Stirring: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure uniform curing quality.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes defoaming to eliminate internal bubbles.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, obviously affected by ambient temperature and humidity.
Application Scenarios & Commercial Value
Widely applied for commercial LED modules, consumer electronics and ordinary industrial control circuit encapsulation. This commercial-grade potting compound stabilizes product performance, reduces daily equipment failure rates, simplifies mass production material selection, and effectively lowers manufacturers’ procurement and after-sales maintenance costs.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global commercial electronic manufacturing safety and environmental specifications.
Customization Options
Customizable curing hardness, colloid viscosity and operating time are available to match personalized commercial encapsulation processes.
Production Process
Adopting standardized mass production and strict batch sampling testing, every batch of commercial standard insulating sealant resin is fully inspected to ensure stable and consistent commercial-grade quality.
FAQ
Q1: What is the positioning of this commercial potting compound?
A: It is a high cost-performance business use protective encapsulant material, specially optimized
for mass commercial electronic encapsulation scenarios.
Q2: Can stratified colloid after storage be used normally?
A: Yes. Even stirring before use can fully restore original sealing and insulating performance
without quality loss.
Q3: Is it suitable for long-term mass production?
A: Absolutely. This commercial potting silicone gel compound features stable performance and
simple operation, ideal for long-term batch commercial electronic production.