Electronic Potting Compound

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Electronic Potting Compound for Gaming Consoles

Brand:
HONG YE SILICONE
Min. Order:
Kilogram
Model No:
HY-9305
Transportation:
Ocean,Land,Air,Express
Packaging:
1kg/5kg/25kg/200kg
Supply Ability:
100Ton
Place of Origin:
HUIZHOU
Productivity:
100TON

HONG YE SILICONE’s Electronic Potting Compound for Gaming Consoles (Model HY-9320) is a high-transparency two-component addition curing silicone, also called transparent electronic glue or silicone potting compound. It features 95% high light...

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Electronic Potting Silicone for Railway Electronics

Brand:
HONG YE SILICONE
Min. Order:
Kilogram
Model No:
HY-9055
Transportation:
Ocean,Land,Air,Express
Packaging:
1kg/5kg/25kg/200kg
Supply Ability:
100Ton
Place of Origin:
HUIZHOU
Productivity:
100TON

HONG YE SILICONE’s Electronic Potting Silicone for Railway Electronics (Models HY-9055/HY-9045) is a high-performance two-component silicone encapsulant tailored for railway electronic components. It is liquid before curing, forming a flexible...

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Company Profile

HONG YE SILICONE is a high-tech enterprise specialized in R&D, production and sales of silicone raw materials,Which founded in 2006 by Guibin Li ,a successful entrepreneur.We excel in platinum-cured silicone technology, supplying premium addition curing silicone for film, medical and industrial sectors. FDA, ROHS and SGS certified, we provide customized solutions and reliable B2B services to global clients with strict quality control.

R & D Strength

Accelerating innovation by revolutionizing manufacturing.

Staffing

We empower companies to bring new ideas to market by offering the fastest in the world.

Electronic Potting Compound

Our Electronic Potting Compound is a professional silicone encapsulant for electronic components, a key part of HONG YE SILICONE’s full silicone product matrix including Industrial Mold Silicone Rubber. As a premium silicone raw material, it cures into a solid layer after adding a curing agent, realizing sealing, filling and pressure-proof protection. With superior adhesion and thermal stability to PC, PMMA, PCB and CPU, its two curing types meet diverse industrial needs, serving as a reliable choice for high-performance electronic component protection.

Product Overview

Product Advantages

1.Comprehensive Protection: Offers excellent anti-corrosion, waterproof, moisture-proof, dust-proof, insulation, thermal conduction and shockproof effects, isolating components from harsh environments.
3. Extreme Temperature Resistance: Works continuously from -60℃ to 220℃, absorbing thermal stress to protect chips and welded gold wires from high-temperature cycles.
2. Strong Environmental Adaptability: Resists ozone and chemical erosion, maintaining stability in complex industrial conditions for long-term use.
4. Superior Material Quality: Low volatile content, high strength, and excellent bonding with aluminum, copper, stainless steel, ensuring durable component protection..

Technical Specifications

Curing Type: Addition curing silicone / Condensation curing silicone
Operating Temperature: -60℃ ~ 220℃
Core Properties: Waterproof, moisture-proof, flame-retardant, insulating, thermally conductive, shockproof
Adhesive Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel
Curing Condition: Room temperature/heating curing, full curing in 24 hours
Material Traits: Low volatility, ozone-resistant, chemical erosion-resistant

Usage Steps

Step 1:Preparation: Fully stir Component A to mix settled fillers; shake Component B thoroughly for uniform consistency.

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Step 2:Mixing: Blend A and B strictly by specified weight ratio to ensure stable curing effect.

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Step 3:Deaeration (Optional): Place mixed adhesive in a vacuum container, deaerate at 0.01MPa for 3 minutes to remove bubbles before potting.

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Step4:Potting & Curing: Pour on target components, cure at room temperature or by heating. Proceed to next process after initial curing; full curing takes 24 hours, affected by temperature and humidity.

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Application Scenarios

Widely used for encapsulating, sealing and filling electronic components, especially LED display modules, CPU peripherals, power supplies, control boards and communication devices. It enhances product stability, reduces failure rates during transportation and use, helping manufacturers improve quality and cut after-sales costs.

Certifications and Compliance

The product has passed FDA and SGS food/medical grade certification, complying with international safety standards for medical and daily use silicone products. Its platinum cured formula meets environmental protection requirements, with no harmful substances released during production and use, suitable for global market sales and application.

Customization

Options

Customization Options

We offer OEM customization services. Hardness, viscosity and operation time of the cured product can be adjusted according to customer needs. Exclusive formulas for high thermal conductivity or ultra-low temperature resistance are available for personalized bulk orders..

Packaging Storage

Shenzhen Hong Ye Jie Technology Co., Ltd

FAQS

Q1: What’s the difference between the two curing types?

A1: Addition curing has faster speed and lower shrinkage for high-precision components; condensation curing is cost-effective for general encapsulation.
Q2: How to store unused adhesive?

A2: Seal A and B separately in a cool dry place. Mixed adhesive must be used at once to avoid waste.
Q3: What if the colloid layers after storage?

A3: Stir thoroughly before use—this is normal and won’t affect performance.
Q4: Is it a hazardous material?

A4: Non-hazardous for transportation. Avoid mouth/eye contact; rinse with water if accidental contact occurs.

Workshop of jinxingrui company, huogang village, Luocun village, Lilin Town, Zhongkai high tech Zone, Huizhou, Guangdong, China.

Telephone

+86-755-89948294

hysc@szrl.net

Mobile

+86-189 2649 6691