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Home> Products> Foamed Silicone> Lightweight Foamed Silicone with Air Pocket Structure
Lightweight Foamed Silicone with Air Pocket Structure
Lightweight Foamed Silicone with Air Pocket Structure
Lightweight Foamed Silicone with Air Pocket Structure
Lightweight Foamed Silicone with Air Pocket Structure
Lightweight Foamed Silicone with Air Pocket Structure
Lightweight Foamed Silicone with Air Pocket Structure

Lightweight Foamed Silicone with Air Pocket Structure

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-F series

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Foamed Silicone Rubber
Product Description
Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a low dielectric constant and high-signal integrity 2-component Addition Curing Silicone, featuring excellent low dielectric performance (dielectric constant ≤3.0 @1MHz), low signal attenuation, high signal integrity, suitable for 5G communication and high-frequency electronic scenarios. It has fine uniform closed-cell pores, -65℃-200℃ temperature resistance, 1:1 easy operation, passed SGS dielectric certification, compatible with Electronic Potting Compound and high-precision Mold Silicone, serving B2B buyers in 5G and electronic industries.
 
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam) is a low dielectric core product, specially developed for 5G communication, high-frequency electronic and signal transmission scenarios. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with low dielectric fillers (such as BN powder), featuring ultra-low dielectric constant, low signal attenuation, high signal integrity, fine uniform closed-cell structure, good elasticity and dielectric stability. It has a dielectric constant of ≤3.0 @1MHz, can effectively reduce signal attenuation, ensure stable signal transmission, solve the problem of traditional foaming materials’ high dielectric constant and serious signal interference. Compatible with most of our electronic and precision products, it is ideal for 5G base stations, high-frequency electronic components and signal transmission scenarios.
 
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Technical Specifications
Type: 2-component addition curing silicone
Low Dielectric Performance: Dielectric constant ≤3.0 @1MHz, low signal attenuation (≤5% at 5GHz), high signal integrity, no signal interference
Foaming Feature: Fine uniform closed-cell pores (30-70μm), low dielectric, no signal shielding, stable dielectric structure
Temperature Range: -65℃ to 200℃ (long-term use)
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated (80℃, 1h) vulcanization
Certifications: SGS eco-toxicity, RoHS, SGS dielectric certification
Key Traits: Low dielectric constant, high signal integrity, dielectric constant ≤3.0 @1MHz, low signal attenuation
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
 
Product Features & Advantages
1. Excellent Low Dielectric Performance: Dielectric constant ≤3.0 @1MHz, low signal attenuation, solving the problem of traditional foaming materials’ high dielectric constant and serious signal interference in high-frequency scenarios.
2. High Signal Integrity: Effectively ensures stable signal transmission, no signal distortion, adapting to 5G and high-frequency electronic scenarios.
3. Low Dielectric & Elasticity Balance: While maintaining ultra-low dielectric constant and high signal integrity, it retains good elasticity and structural stability, no brittle fracture, balancing signal protection and usability.
4. Compatibility with Electronic Products: Compatible with HONG YE SILICONE’s electronic Potting Compound and high-precision mold silicone, forming a complete 5G and high-frequency electronic solution, enabling one-stop procurement.
5. Easy Operation: 1:1 simple mixing ratio, good flowability, easy to process into low dielectric components, no professional high-frequency operation skills required, improving production efficiency.
 
How to Use
1. Take Part A and Part B according to 1:1 weight ratio, stir separately to eliminate sediment, ensure no impurities (avoid affecting dielectric performance and signal transmission).
2. Mix and stir thoroughly for 3 minutes until homogeneous, vacuum degas to remove air bubbles (ensure dielectric uniformity and closed-cell structure).
3. Pour the mixture into low dielectric component mold (paired with electronic potting compound), foam and cure at room temperature or by heating.
4. After full curing, the product has low dielectric constant and low signal attenuation, ready for use in 5G and high-frequency electronic scenarios.
 
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Application Scenarios
Focus on high-frequency electronic scenarios: 5G base station antenna components (paired with high-precision mold silicone), high-frequency electronic enclosures (paired with electronic potting compound), signal transmission buffers (paired with electronic potting compound), low dielectric robot parts (paired with robot silicone), and 5G terminal equipment components (paired with high-precision mold silicone). It helps 5G and electronic buyers ensure stable signal transmission and improve product performance.
 
Certifications and Compliance
Passed SGS eco-toxicity certification, RoHS compliant, SGS dielectric certification, excellent low dielectric and high-signal integrity performance, meeting the high-frequency electronic procurement requirements of B2B buyers in 5G, electronic and communication industries, facilitating export to global markets.
 
Customization Options
Customizable dielectric constant (≤2.5 @1MHz for high-demand scenarios), signal attenuation rate, foaming ratio and hardness, adapting to different 5G and high-frequency electronic requirements, helping buyers optimize signal transmission effect.
 
Production Process
Low dielectric-oriented production process: High-purity low dielectric Silicone raw materials → formula optimization (add low dielectric fillers such as BN powder) → precision mixing → dielectric constant test → signal attenuation test → standardized curing → dielectric stability inspection → packaging. Strict dielectric testing ensures product low signal attenuation and high signal integrity.
 
FAQ
Q1: What is the dielectric constant? A: ≤3.0 @1MHz, low dielectric, low signal attenuation.
Q2: Is it suitable for 5G scenarios? A: Yes, low signal attenuation, high signal integrity, ideal for 5G base stations and terminal equipment.
Q3: Will it interfere with signal transmission? A: No, low dielectric constant, no signal shielding, no signal interference, ensuring stable transmission.
Q4: Can it be used for high-frequency electronics? A: Yes, suitable for high-frequency electronic components, effectively reducing signal attenuation.
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