Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a high thermal conductivity 2-component Addition Curing Silicone, featuring excellent thermal conductivity (thermal conductivity ≥1.5 W/(m·K)), heat dissipation, temperature uniformity, suitable for heat dissipation, high-temperature heat transfer and electronic cooling scenarios. It has fine uniform closed-cell pores, -65℃-200℃ temperature resistance, 1:1 easy operation, passed SGS thermal conductivity certification, compatible with Electronic Potting Compound and high-temperature insulation silicone, serving B2B buyers in electronic, automotive and heat dissipation industries.
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam ) is a high thermal conductivity heat dissipation core product, specially developed for heat dissipation, high-temperature heat transfer and electronic cooling scenarios. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with thermal conductive fillers and heat dissipation modifiers, featuring ultra-high thermal conductivity, effective heat dissipation, fine uniform closed-cell structure, good elasticity and thermal stability. It has a thermal conductivity of ≥1.5 W/(m·K), effectively transferring heat, improving heat dissipation efficiency, ensuring temperature uniformity, solving the problem of traditional foaming materials’ poor thermal conductivity in heat dissipation scenarios. Compatible with most of our electronic and high-temperature products, it is ideal for heat dissipation components, thermal conductive buffers and electronic cooling scenarios.
Technical Specifications
Type: 2-component addition curing silicone
Thermal Conductivity & Heat Dissipation: Thermal conductivity ≥1.5 W/(m·K), heat dissipation, temperature uniformity (temperature difference ≤3℃), thermal stability, heat transfer efficiency ≥90%
Foaming Feature: Fine uniform closed-cell pores (20-40μm), thermal conductive structure, dense pore distribution, uniform heat transfer, no heat accumulation
Temperature Range: -65℃ to 200℃ (long-term use)
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated (80℃, 1h) vulcanization
Certifications: SGS eco-toxicity, RoHS, SGS thermal conductivity certification
Key Traits: High thermal conductivity, heat dissipation, thermal conductivity ≥1.5 W/(m·K), temperature uniformity
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
Product Features & Advantages
1. Excellent Thermal Conductivity: Thermal conductivity ≥1.5 W/(m·K), effective heat transfer, solving the problem of traditional foaming materials’ poor thermal conductivity in heat dissipation scenarios.
2. Efficient Heat Dissipation: Heat transfer efficiency ≥90%, temperature uniformity, no heat accumulation, effectively reducing product temperature and extending service life.
3. Thermal Conductivity & Elasticity Balance: While maintaining ultra-high thermal conductivity and heat dissipation performance, it retains good elasticity and structural stability, no brittle fracture, balancing heat dissipation and usability.
4. Compatibility with Heat Dissipation Products: Compatible with HONG YE SILICONE’s electronic Potting Compound and high-temperature insulation silicone, forming a complete heat dissipation solution, enabling one-stop procurement. 5. Easy Operation: 1:1 simple mixing ratio, good flowability, easy to process into heat dissipation components, no professional heat dissipation operation skills required, improving production efficiency.
How to Use
1. Take Part A and Part B according to 1:1 weight ratio, stir separately to eliminate sediment, ensure no impurities (avoid affecting thermal conductivity and heat dissipation).
2. Mix and stir thoroughly for 3 minutes until homogeneous, vacuum degas to remove air bubbles (ensure thermal conductivity uniformity and closed-cell structure).
3. Pour the mixture into heat dissipation component mold (paired with electronic potting compound), foam and cure at room temperature or by heating for better thermal conductivity.
4. After full curing, the product has excellent thermal conductivity and heat dissipation performance, ready for use in heat dissipation and electronic cooling scenarios.
Application Scenarios
Focus on heat dissipation scenarios: Electronic heat dissipation buffers (paired with electronic potting compound), automotive high-temperature heat transfer components (paired with Industrial mold silicone rubber), electronic cooling parts (paired with high-precision Mold Silicone ), heat dissipation robot parts (paired with robot silicone), and high-temperature heat transfer packaging (paired with Liquid Tank Silicone). It helps heat-dissipation buyers improve heat dissipation efficiency and protect products from high-temperature damage.
Certifications and Compliance
Passed SGS eco-toxicity certification, RoHS compliant, SGS thermal conductivity certification, excellent thermal conductivity and heat dissipation performance, meeting the heat dissipation procurement requirements of B2B buyers in electronic, automotive and heat dissipation industries, facilitating export to global markets.
Customization Options
Customizable thermal conductivity (≥2.0 W/(m·K) for high-demand scenarios), heat transfer efficiency (≥95% for high-demand scenarios), foaming ratio and hardness, adapting to different heat dissipation and high-temperature heat transfer requirements, helping buyers optimize heat dissipation effect.
Production Process
Thermal conductive-oriented production process: High-purity thermal conductive Silicone raw materials → formula optimization (add thermal conductive fillers and heat dissipation modifiers) → precision mixing → thermal conductivity test → heat dissipation test → standardized curing → thermal stability inspection → packaging. Strict thermal testing ensures product effective heat transfer and heat dissipation.
FAQ
Q1: What is the thermal conductivity? A: ≥1.5 W/(m·K), excellent thermal conductivity, effective heat transfer and heat dissipation.
Q2: Can it improve heat dissipation efficiency? A: Yes, heat transfer efficiency ≥90%, temperature uniformity, no heat accumulation, effectively reducing product temperature.
Q3: Is it suitable for electronic cooling? A: Yes, paired with electronic potting compound, ideal for electronic heat dissipation buffers and electronic cooling components.
Q4: Will high temperature affect its thermal conductivity? A: No, stable performance in -65℃-200℃, thermal conductivity remains unchanged, ensuring heat dissipation in high-temperature environments.
Shenzhen Hong Ye Jie Technology Co., Ltd
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