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Home> Products> Foamed Silicone> High-Performance Foamed Silicone for Secure Sealing
High-Performance Foamed Silicone for Secure Sealing
High-Performance Foamed Silicone for Secure Sealing
High-Performance Foamed Silicone for Secure Sealing
High-Performance Foamed Silicone for Secure Sealing
High-Performance Foamed Silicone for Secure Sealing
High-Performance Foamed Silicone for Secure Sealing

High-Performance Foamed Silicone for Secure Sealing

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-F series

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Product Description
Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a high-conductivity 2-component Addition Curing Silicone, featuring excellent electrical conductivity (surface resistance ≤10⁴ Ω), stable conductive performance, no resistance drift, suitable for conductive components, electrostatic grounding and electromagnetic shielding scenarios. It has fine uniform closed-cell pores, -65℃-200℃ temperature resistance, 1:1 easy operation, passed SGS conductivity test, compatible with high-precision Mold Silicone and Electronic Potting Compound, serving B2B buyers in electronic, conductive and electromagnetic shielding industries.
 
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam ) is a high-conductivity core product, specially developed for conductive components, electrostatic grounding and electromagnetic shielding scenarios. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with conductive fillers and stability modifiers, featuring ultra-strong electrical conductivity, stable surface resistance, no resistance drift, fine uniform closed-cell structure, good elasticity and conductive stability. It effectively conducts electricity, realizes electrostatic grounding, and assists in electromagnetic shielding, solving the problem of traditional foaming materials’ non-conductivity in electronic conductive scenarios. Compatible with most of our conductive products, it is ideal for conductive components, grounding buffers and electromagnetic shielding scenarios.
 
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Technical Specifications
Type: 2-component addition curing silicone
High Conductivity: Surface resistance ≤10⁴ Ω (ASTM D257), stable conductive performance, no resistance drift, conductive stability ≥95%, good electrical conductivity
Foaming Feature: Fine uniform closed-cell pores (20-40μm), conductive structure, dense pore distribution, uniform conductivity, structural integrity after conductivity test
Temperature Range: -65℃ to 200℃ (long-term use)
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated (80℃, 1h) vulcanization
Certifications: SGS eco-toxicity, RoHS, SGS conductivity test certification
Key Traits: High conductivity (≤10⁴ Ω), stable resistance, no drift
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
 
Product Features & Advantages
1. Excellent Electrical Conductivity: Surface resistance ≤10⁴ Ω, stable conductive performance, solving the problem of traditional foaming materials’ non-conductivity in electronic conductive scenarios.
2. No Resistance Drift: Conductive stability ≥95%, resistance remains unchanged during long-term use, ensuring stable conductive effect.
3. Conductivity & Elasticity Balance: While maintaining ultra-strong conductivity, it retains good elasticity and structural stability, no brittle fracture, balancing conductivity and usability.
4. Compatibility with Conductive Products: Compatible with HONG YE SILICONE’s high-precision mold silicone and electronic Potting Compound, forming a complete conductive solution, enabling one-stop procurement.
5. Easy Operation: 1:1 simple mixing ratio, good flowability, easy to process into conductive components, no professional conductive operation skills required, improving production efficiency.
 
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Application Scenarios
Focus on conductive scenarios: Electronic component conductive buffers (paired with high-precision mold silicone), electrostatic grounding parts (paired with electronic potting compound), electromagnetic shielding packaging (paired with Liquid Tank Silicone), conductive machinery components (paired with Industrial mold silicone rubber), and conductive robot parts (paired with robot silicone). It helps electronic and conductive industry buyers realize stable conductivity and electrostatic grounding.
 
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FAQ
Q1: What is the surface resistance?
A: ≤10⁴ Ω, stable conductive performance, suitable for conductive and electrostatic grounding scenarios.
Q2: Will the resistance drift during use?
A: No, conductive stability ≥95%, resistance remains unchanged, ensuring stable conductive effect.
Q3: Is it suitable for electromagnetic shielding?
A: Yes, paired with electronic potting compound, it can assist in electromagnetic shielding while conducting electricity.
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