Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a high heat dissipation 2-component Addition Curing Silicone, featuring excellent thermal conductivity (thermal conductivity ≥0.8 W/(m·K)), fast heat transfer, heat dissipation stability, suitable for heat-generating electronic components, LED equipment and heat dissipation scenarios. It has fine uniform closed-cell pores, -65℃-200℃ temperature resistance, 1:1 easy operation, passed SGS thermal conductivity test, compatible with high-precision Mold Silicone and Electronic Potting Compound, serving B2B buyers in electronic, LED and heat dissipation industries.
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam ) is a high heat dissipation core product, specially developed for heat-generating electronic components, LED equipment and heat dissipation scenarios. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with thermal conductive fillers and heat dissipation modifiers, featuring ultra-strong thermal conductivity, fast heat transfer, fine uniform closed-cell structure, good elasticity and heat dissipation stability. It effectively transfers and dissipates heat, reduces component temperature, solves the problem of traditional foaming materials’ poor heat dissipation in heat-generating scenarios. Compatible with most of our thermal conductive products, it is ideal for heat dissipation components, thermal conductive buffers and heat-generating equipment.
Technical Specifications
Type: 2-component addition curing silicone
High Heat Dissipation: Thermal conductivity ≥0.8 W/(m·K) (ASTM D5470), fast heat transfer, heat dissipation stability ≥95%, no heat accumulation
Foaming Feature: Fine uniform closed-cell pores (20-40μm), thermal conductive structure, dense pore distribution, uniform heat transfer, structural integrity after heat dissipation test
Temperature Range: -65℃ to 200℃ (long-term use)
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated (80℃, 1h) vulcanization
Certifications: SGS eco-toxicity, RoHS, SGS thermal conductivity test certification
Key Traits: High heat dissipation (≥0.8 W/(m·K)), fast heat transfer
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
Product Features & Advantages
1. Excellent Heat Dissipation: Thermal conductivity ≥0.8 W/(m·K), fast heat transfer, solving the problem of traditional foaming materials’ poor heat dissipation in heat-generating scenarios.
2. Heat Dissipation Stability: Heat dissipation performance remains stable in long-term use, no heat accumulation, effectively protecting heat-generating components from overheating.
3. Heat Dissipation & Elasticity Balance: While maintaining high heat dissipation performance, it retains good elasticity and structural stability, no brittle fracture, balancing heat dissipation and usability.
4. Compatibility with Thermal Conductive Products: Compatible with HONG YE SILICONE’s high-precision mold silicone and electronic Potting Compound, forming a complete heat dissipation solution, enabling one-stop procurement. 5. Easy Operation: 1:1 simple mixing ratio, good flowability, easy to process into heat dissipation components, no professional heat dissipation operation skills required, improving production efficiency.
Application Scenarios
Focus on heat dissipation scenarios: Heat-generating electronic component thermal conductive buffers (paired with high-precision mold silicone), LED equipment heat dissipation pads (paired with electronic potting compound), heat dissipation packaging (paired with Liquid Tank Silicone), industrial heat-generating machinery components (paired with Industrial mold silicone rubber), and LED robot heat dissipation parts (paired with robot silicone). It helps electronic and LED industry buyers improve heat dissipation efficiency and protect equipment.
FAQ
Q1: What is the thermal conductivity?
A: ≥0.8 W/(m·K), fast heat transfer, suitable for heat dissipation scenarios.
Q2: Will it accumulate heat during long-term use?
A: No, heat dissipation stability ≥95%, no heat accumulation, effectively dissipating heat continuously.
Q3: Is it suitable for LED equipment?
A: Yes, paired with electronic potting compound, ideal for LED equipment heat dissipation pads and thermal conductive components.
Shenzhen Hong Ye Jie Technology Co., Ltd
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