High-Performance Foamed Silicone Compound for Electronics

High-Performance Foamed Silicone Compound for Electronics

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Payment Type:	T/T,Paypal
Incoterm:	FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:	1 Kilogram
Transportation:	Ocean,Land,Air,Express
Port:	shenzhen

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Product Description

Product Attributes

Packaging & Delivery

Product Description

Product Attributes

Model No.: HY-F series

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery

Selling Units	:	Kilogram
Package Type	:	1kg/5kg/25kg/200kg
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foamed silicone rubber 16

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Product Description

Product Abstract

HongYe silicone rubber.Our Silicone Potting Compound is a high-performance Electronic Encapsulation Adhesive, specially developed for electronic component protection. This thermally conductive potting silicone features excellent insulation, heat dissipation and waterproof performance. As a core electronic encapsulation material, it can effectively protect circuit boards, sensors and electronic modules, reduce product failure rate caused by temperature, moisture and vibration, and improve the stability and service life of electronic products.

Product Overview

Silicone Potting Compound is a liquid Silicone Encapsulant belonging to Electronic Potting Compound series. It includes thermally conductive and conventional insulating types, with good fluidity before curing and forming a flexible colloid after curing. This electronic encapsulation adhesive has strong adhesion, excellent weather resistance and chemical stability. Different from epoxy potting resin, it has low stress and will not damage precision electronic components, widely used in waterproof, insulation and shockproof protection of various electronic equipment.

Core Product Features & Advantages

1. Superior insulation performance: Effectively isolate current, prevent short circuit and leakage, ensure safe operation of electronic equipment.

2. Excellent heat dissipation and temperature resistance: Stable performance in -60℃ to 200℃ environment, quickly export internal heat of equipment.

3. Shockproof and waterproof: Flexible colloid after curing, buffer vibration impact, fully seal and prevent moisture and dust from entering.

4. Low stress and no damage: Soft curing state, no extrusion damage to precision electronic components and circuits.

5. Durable and anti-aging: Resist ultraviolet and chemical corrosion, long-term use without yellowing and failure.

Step-by-Step Usage Instructions

1. Material preparation: Stir A and B components of silicone encapsulant separately to uniform state.

2. Proportional mixing: Mix according to the specified ratio, stir fully for 2-3 minutes to ensure uniform mixing.

3. Vacuum defoaming: Remove internal bubbles to avoid bubble holes affecting potting protection effect.

4. Potting and curing: Evenly pour the glue into electronic module gaps, and cure at room temperature or heating condition.

Application Scenarios

This silicone potting compound is widely used in electronic encapsulation and protection. It is suitable for potting and waterproof insulation of power modules, circuit boards, sensors, power supplies and automotive electronic components. The Thermally Conductive Potting Compound is specially used for high-heat electronic equipment, solving heat dissipation problems, while conventional products meet daily insulation and waterproof needs, helping buyers improve electronic product stability and after-sales quality.

Precautions

Keep away from sulfur, tin and other inhibitor substances to avoid incomplete curing. Avoid high-temperature baking before curing, and store in a dry and ventilated environment.

Packaging & Storage

Standard packaging: 20KG, 25KG, 200KG per barrel. Non-dangerous goods transportation, sealed and low-temperature storage is recommended.

FAQ

Q1: What is the difference between silicone potting compound and epoxy potting resin?

A1: Silicone potting compound has softer texture, lower stress and better temperature resistance, suitable for precision electronics; epoxy resin is high-hard and high-strength.

Q2: Can the thermally conductive potting compound solve equipment overheating?

A2: Yes, it has excellent thermal conductivity, which can quickly conduct heat and reduce equipment operating temperature.

Q3: Is the electronic encapsulation adhesive waterproof?

A3: Fully waterproof and moisture-proof, which can effectively isolate water vapor and protect internal electronic components.

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