Liquid Silicone Potting Compound for PCB

Liquid Silicone Potting Compound for PCB

Name: liquid tank adhesive3
Uploaded: 2026-01-28T08:30:58+08:00
Description: HONG YE SILICONE Electronic Potting Compound is a two-component addition-curing RTV silicone gel, widely used for

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Payment Type:	T/T,Paypal
Incoterm:	FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:	1 Kilogram
Transportation:	Ocean,Land,Air,Express
Port:	shenzhen

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Product Description

Product Attributes

Model No.: HY-9400/HY-9405

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery

Selling Units	:	Kilogram
Package Type	:	1kg/5kg/25kg/200kg
Picture Example	:

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liquid tank adhesive3

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Product Description

HONG YE SILICONE Electronic Potting Compound is a two-component addition-curing RTV silicone gel, widely used for electronic encapsulation, PCB potting, and liquid tank filter sealing. It delivers excellent insulation, waterproofing, shock absorption, and high/low-temperature resistance. With good adhesion to metals and plastics, it supports room or heat curing, ideal for electronics, filters, and high-temperature equipment.

Product Overview

HONG YE SILICONE Electronic Potting Compound (also called Liquid Tank Silicone, Jelly Silicone Gel, Filter Potting Silicone) is a professional two-component silicone potting material. It provides stable protection for electronic components and efficient sealing for liquid tank filters. This safe, eco-friendly, high-toughness silicone ensures long-term sealing, insulation, and durability in various industrial environments.

Product Features & Advantages

Low viscosity for easy pouring and bubble-free potting

Cures at room temperature or accelerated by heating

Soft, elastic, and great resilience without cracking

Outstanding waterproof, moisture-proof, and anti-shock performance

Excellent chemical stability, weather resistance, and high/low-temperature tolerance

No oil leakage after curing; no byproducts during reaction

Strong adhesion to aluminum, galvanized steel, stainless steel, PC, PP, ABS, PVC

How to Use

Stir Part A and Part B separately before mixing.

Mix Part A and Part B at a 1:1 weight ratio.

Degas the mixture at 0.08MPa for about 3 minutes.

Pour directly into liquid tank frames or electronic components.

Cure 3–8 hours at room temperature, or 20 minutes at 80–100°C.

Application Scenarios

Potting for PCB, power modules, optical electronics, LCD manufacturing

Sealing for liquid tank HEPA filters and air supply outlets

Bonding and sealing for high-temperature ovens, filters, and induction cookers

Insulation and protection for precision electronic components

Certifications & Compliance

Our Electronic Potting Compound is produced under strict quality systems, supporting ISO9001, CE, UL certified manufacturing standards for global market applications.

Customization Options

We provide color customization (transparent, blue, etc.) and packaging customization for Part A and Part B to meet different industrial and project requirements.