HONG YE SILICONE Electronic Potting Compound, also known as Silicone Encapsulant and Silicone Potting Compound, is a premium two-component RTV 2 Silicone Rubber made of high-purity Silicone raw materials. It provides reliable sealing, moisture-proof, shockproof and insulation protection for circuit boards, precision electronic components and high-temperature equipment. With low viscosity, 1:1 mixing ratio, dual curing modes and strong adhesion, it helps global B2B buyers improve product stability, reduce maintenance costs and enhance production efficiency, fully complying with ISO9001, UL and CE standards.
Product Overview
As a professional manufacturer of silicone raw materials and Industrial mold silicone rubber, HONG YE SILICONE offers high-performance Electronic Potting Compound —an essential solution for electronic component protection. This two-component Addition Curing Silicone consists of transparent Part A and customizable blue Part B (color adjustable per request), featuring safety, eco-friendliness and high toughness. It is the preferred choice for global B2B buyers, dedicated to potting electronic circuit boards, protecting optical electronics and precision components, integrating seamlessly with our Pad Printing Silicone and Liquid Mold Silicone for one-stop industrial silicone solutions.
Product Features & Advantages
Our Electronic Potting Compound outperforms competitors with advanced formula and strict quality control. Made of high-quality silicone raw materials, it has excellent chemical stability, moderate hardness and good elastic recovery, capable of absorbing thermal expansion stress without cracking to ensure long-term reliable protection. Unlike ordinary potting materials, it has low viscosity for easy pouring and full coverage of components, supports both room temperature (3-8 hours) and heat curing (80-100℃ for 20 minutes) for flexible operation. It adheres well to aluminum, galvanized sheet, stainless steel, PC, PP, ABS and PVC, cures without oil leakage or harmful byproducts, and boasts outstanding weather, corrosion and high-low temperature resistance, making it more reliable for electronic applications.
Technical Specifications
This two-component addition curing silicone requires Part A:Part B = 1:1 (weight ratio). Before use, the mixed glue needs degassing at 0.08MPa for 3 minutes to remove air bubbles. Curing time: 3-8 hours at room temperature; 20 minutes at 80-100℃ (recommended for winter). It is non-hazardous, with a 1-year storage period (sealed, away from acid, alkali and impurities). Standard packaging: Part A and Part B are both available in 1KG, 5KG, 20KG, 25KG and 200KG/barrel, suitable for small-batch testing and large-scale industrial production.
How to Use
1. Before mixing, fully stir Part A and Part B separately in their respective containers to ensure uniformity and avoid stratification.
2. Mix Part A and Part B strictly at a 1:1 weight ratio, stirring thoroughly for 3-5 minutes to ensure complete fusion.
3. Degas the mixed glue at 0.08MPa for 3 minutes to eliminate air bubbles, then directly pour it into electronic components or circuit board housings.
4. Maintain the specified temperature during and after curing; heating at 80-100℃ for 20 minutes in winter ensures fast and stable curing.
Application Scenarios
This Electronic Potting Compound brings tangible value to global buyers: 30% lower maintenance costs, 25% higher product qualification rate and longer service life of electronic devices. Main applications include potting of electronic circuit boards; moisture-proofing and insulation for optical electronics, LCD manufacturing and precision components; bonding and sealing of high-temperature equipment (ovens, high-temperature air filters, induction cookers). It is widely used in electronic manufacturing, instrumentation and machinery processing industries, complementing our Electronic Encapsulation Adhesive for comprehensive protection.
Certifications and Compliance
Our Electronic Potting Compound is produced under strict ISO9001 quality management system, with UL and CE international certifications. It meets international industrial safety and quality standards, enabling smooth customs clearance for global buyers and enhancing procurement credibility.
Customization Options
To meet diverse personalized needs, we provide professional customization: Part B color can be adjusted according to customer requirements; we also offer hardness adjustment and formula optimization for special application environments. OEM services are available, aligning with our Mold Making Silicone customization capabilities to provide tailored solutions.
Production Process
Using high-quality silicone raw materials, we adopt standardized production processes: pre-production sample testing to ensure performance; in-process inspections to avoid defects; pre-shipment final inspection to guarantee batch consistency. Advanced production lines and a professional QC team ensure stable product quality and on-time delivery.
FAQ
Q: Will this potting compound damage PC, ABS or other plastics?
A: No, it is fully compatible with PC, PP, ABS, PVC and most metals, without corrosion.
Q: Why slow curing in winter?
A: Low temperature slows the reaction; heat at 80-100℃ for 20 minutes.
Q: How to store it?
A: Sealed, 1-year shelf life; stir if stratified.
Q: Is it hazardous for shipping?
A: No, it is non-hazardous.
Q: Can mixed glue be reused?
A: No, use entirely at once for optimal performance.
Q: What chemicals should be avoided?
A: Avoid contact with chemicals that may inhibit curing to ensure normal performance.
Shenzhen Hong Ye Jie Technology Co., Ltd
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