High Viscosity Electronic Potting Silicone for LED Light

High Viscosity Electronic Potting Silicone for LED Light

Name: Liquid Tank Adhesive
Uploaded: 2026-01-28T06:43:37+08:00
Description: HONG YE SILICONE Silicone Encapsulant is a low-viscosity RTV 2 Silicone Rubber made of high-quality Silicone raw

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Payment Type:	T/T,Paypal
Incoterm:	FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:	1 Kilogram
Transportation:	Ocean,Land,Air,Express
Port:	shenzhen

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Product Description

Product Attributes

Model No.: HY-9400/HY-9405

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery

Selling Units	:	Kilogram
Package Type	:	1kg/5kg/25kg/200kg
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Liquid Tank Adhesive

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Product Description

HONG YE SILICONE Silicone Encapsulant is a low-viscosity RTV 2 Silicone Rubber made of high-quality Silicone raw materials. As an advanced Electronic Encapsulation Adhesive and Filter Potting Silicone, it adopts Addition Curing Silicone technology, with excellent fluidity and bubble-free performance. It can fully fill tiny gaps of precision electronic components, with strong adhesion and stable performance, suitable for PCB, LCD and miniature electronic modules, helping buyers improve potting efficiency and product quality.

Product Overview

Our low-viscosity Electronic Potting Compound is a dual-component liquid material, with transparent Part A and customizable Part B. It is also called liquid tank jelly glue, with fluidity comparable to High transparency mold silicone. It is specially designed for precision electronic components, solving the problem of difficult pouring of dense elements, and ensuring full encapsulation and reliable protection.

Technical Specifications

A/B mixing ratio: 1:1 by weight; vacuum degassing for 3 minutes under 0.08MPa. Curing time: 3-8 hours (room temperature), 20 minutes (80~100℃). Low viscosity (easy to flow); shelf life: 1 year; packaging: 1-200KG/barrel; non-hazardous transportation. Compatible with various precision component materials.

Product Features

Ultra-low viscosity, flowing freely into tiny gaps without manual auxiliary filling. Fast defoaming, no bubble residue after pouring, ensuring insulation performance. Moderate softness after curing, no damage to precision components. It bonds firmly with metals and plastics, no shrinkage or oil leakage, and supports dual curing modes for flexible operation.

How to Use

1. Stir standing Part A and Part B to restore fluidity. 2. Mix evenly at 1:1 ratio, control stirring speed to avoid air mixing. 3. Degas briefly, then pour slowly along the edge of components. 4. Choose curing mode according to production speed.

Application Scenarios

Ideal for miniature LED modules, lamp strip PCBs, small intelligent control PCBs and precision electronic power modules. It is also suitable for liquid tank filter internal filling, improving construction efficiency and reducing production waste.

Certifications and Compliance

Meets electronic industry environmental protection and safety standards, supporting global small electronic product export.

Customization Options

Adjustable viscosity range to match different gap sizes of electronic components, optimizing fluidity for targeted needs.

Production Process

Adopts fine grinding raw material processing, consistent with the standard of Condensation Curing Silicone Mold Rubber, ensuring stable fluidity of finished products.

FAQ

Q: Can it fill gaps between dense SMT components?

A: Yes, ultra-low viscosity ensures no dead filling angle.

Q: Will bubbles appear inside after pouring?

A: Simple defoaming can achieve bubble-free encapsulation.

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