Reliable Liquid Silicone for Potting Electronic Encapsulation

Reliable Liquid Silicone for Potting Electronic Encapsulation

Name: Liquid tank adhesive 9400（2）
Uploaded: 2026-01-28T06:31:21+08:00
Description: HONG YE SILICONE Potting Compound is a high-efficiency fast-curing Addition curing silicone designed for mass

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Payment Type:	T/T,Paypal
Incoterm:	FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:	1 Kilogram
Transportation:	Ocean,Land,Air,Express
Port:	shenzhen

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Product Description

Product Attributes

Model No.: HY-9400/HY-9405

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery

Selling Units	:	Kilogram
Package Type	:	1kg/5kg/25kg/200kg
Picture Example	:

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Liquid tank adhesive 9400（2）

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Product Description

HONG YE Silicone Potting Compound is a high-efficiency fast-curing Addition Curing Silicone designed for mass production. As a professional Electronic Encapsulation Adhesive and Filter Potting Silicone, it is made of high-activity Silicone raw materials. This RTV 2 Silicone Rubber shortens heating curing time significantly, while retaining excellent insulation and sealing performance, fitting LED factories and PCB assembly lines, helping buyers improve production output and reduce costs.

Product Overview

Our fast-curing Electronic Potting Compound is a dual-component liquid material, with transparent Part A and blue Part B (color customizable). It optimizes curing catalyst ratio, with reasonable usable time, perfectly matching assembly line continuous operation. Its quality is consistent with Rapid prototyping silicone, ensuring stable batch performance for mass production.

Technical Specifications

A/B mixing ratio: 1:1 by weight; vacuum degassing for 3 minutes under 0.08MPa.

Heating curing: 20 minutes at 80~100℃;

room temperature curing: 3-8 hours.

Shelf life: 1 year; packaging: 1-200KG/barrel;

non-hazardous transportation. Compatible with automatic gluing equipment.

Product Features

Fast heating curing speed, accelerating product offline. Low viscosity, suitable for automatic pouring. Strong universal adhesion to common materials. Stable batch performance, no performance fluctuation. Dual curing modes, flexible adaptation to assembly line rhythm, no loss of core performance.

How to Use

1. Pre-stir raw materials at assembly line stations.

2. Automatically mix A/B at 1:1 ratio by equipment.

3. Degas uniformly and pour continuously.

4. Adopt heating curing for fast batch forming.

Application Scenarios

Suitable for large-batch production of LED lamp panels, power supply PCBs, driving circuits and standardized liquid tank filters. It saves time and labor costs, enhancing enterprise competitiveness.

Certifications and Compliance

Meets industrial mass production quality standards, supporting stable delivery of large orders.