HY-933 Addition Cure Anti-static Pad Printing Silicone Rubber Platinum Cured ESD Protection Silicone for Electronic Semiconducto

HY-933 is an addition cure, platinum-catalyzed anti-static grade Pad Printing Silicone from HYC-Silicone's HY-9 series. Unlike traditional condensation cure silicones, this product cures via platinum-catalyzed addition reaction with ultra-low shrinkage (<0.1%) and high dimensional accuracy. It also provides stable anti-static performance (surface resistance 10^8-10^10 Ω), making it the material of choice for pad printing in precision electronics, semiconductors and other ESD-sensitive industries.

For pad printing workshops manufacturing precision electronic components and semiconductor products, ordinary condensation silicones can build up static charge — potentially damaging chips or attracting dust that affects print quality. HY-933's anti-static properties effectively prevent these issues, making pad printing production more stable and reliable.

Key Features

1. Anti-Static Performance: Surface resistance 10^8-10^10 Ω, effectively prevents electrostatic buildup, protects precision components

2. Addition Cure Platinum System: <0.1% shrinkage, extremely high dimensional accuracy, ideal for fine pattern printing

3. No By-Products: No low-molecular by-products during curing, no contamination to printed products

4. Good Heat Resistance: Withstands higher operating temperatures, adapts to various production environments

5. Excellent Rebound: Fast elastic recovery, no deformation after repeated pressing

6. Uniform Ink Transfer: Stable ink transfer, sharp and clear patterns

7. Environmentally Safe: Meets RoHS and other environmental standards, suitable for export products

Technical Specifications

Appearance: Light color / semi-transparent viscous liquid

Curing System: Addition cure (platinum catalyst)

Hardness: Shore A 20-25°

Anti-Static Level: Surface resistance 10^8 ~ 10^10 Ω

Working Time: 30-60 minutes

Initial Cure: 2-4 hours at room temperature

Full Cure: 12-24 hours at room temperature (or 1 hour at 80°C)

Shrinkage Rate: < 0.1%

Tear Strength: ≥ 20 kN/m

Applications

• Precision electronic component printing — chip marking, PCB boards, connectors

• Semiconductor product printing — wafers, IC packaging, LEDs

• Medical electronics printing — medical device housings, sensors

• Automotive electronics printing — automotive keypads, dashboard components

• High-end manufacturing products with ESD sensitivity

How to Use

1. Stir Part A and Part B thoroughly before use

2. Weigh Part A and Part B accurately at 1:1 weight ratio

3. Mix thoroughly (recommended 2-3 minutes)

4. Degas under vacuum for 3-5 minutes

5. Pour slowly into the mold to avoid introducing new bubbles

6. Cure at room temperature for 12-24 hours, or accelerate at 80°C for 1 hour

7. Demold and use after full cure

Notes

• Addition cure silicone is sensitive to sulfur, tin and amines — keep working environment and tools free of these contaminants to avoid cure inhibition

• Use separate weighing tools for Part A and Part B to avoid cross-contamination

• Seal containers tightly after use to prevent contamination

• Recommended to operate in a clean, dust-free environment for best quality

About HYC-Silicone

Shenzhen Hongyejie Technology Co., Ltd. (HYC-Silicone) is a national high-tech enterprise with over 20 years of silicone R&D and manufacturing experience. Our HY-9 series pad printing silicone covers both condensation and addition cure systems with 6 models, meeting the pad printing needs of different industries and precision levels.