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Home> Products> Electronic Potting Compound> High Performance Electronic Potting Compound
High Performance Electronic Potting Compound
High Performance Electronic Potting Compound
High Performance Electronic Potting Compound
High Performance Electronic Potting Compound
High Performance Electronic Potting Compound
High Performance Electronic Potting Compound
High Performance Electronic Potting Compound
High Performance Electronic Potting Compound
High Performance Electronic Potting Compound

High Performance Electronic Potting Compound

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Payment Type:T/T,Paypal
Incoterm:FOB,DDP,DDU,CFR,CIF,Express Delivery,EXW,FAS,DAF,FCA,DES,CPT,CIP,DEQ
Min. Order:10 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9020

BrandHONG YE SILICONE

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/20kg/25/kg/200kg
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electronic potting compound
Product Description
HONG YE SILICONE Electronic Potting Compound, also called Silicone Encapsulant, is a premium liquid silicone material with waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. It cures solid after mixing with a curing agent, offering excellent adhesion to PC, PMMA, PCB and CPU. Available in addition and condensation curing types, it works stably from -60℃ to 220℃. This product complements our core lines like RTV 2 Silicone Rubber, Pad Printing Silicone and Food grade mold silicone, delivering reliable protection for global electronic manufacturers.
 
Electronic Potting Compound
Electronic Potting Compound
 
 Product Overview
Our Electronic Potting Compound is a high-performance silicone-based encapsulation adhesive designed for sealing, filling and protecting electronic components. Mixed with a curing agent, the liquid turns into a solid protective layer that shields components from moisture, dust, corrosion and vibration. Compatible with PC, PMMA, PCB and CPU, it ensures superior adhesion and thermal stability. As a key offering of HONG YE JIE, it aligns with our other quality products such as Medical Grade Body Silicone to meet diverse industrial needs.
 
 Product Features and Advantages
1.  Comprehensive Protection: Provides waterproof, moisture-proof, dust-proof, anti-corrosion, insulation, thermal conductivity and shockproof functions, ensuring component safety in harsh environments.
2.  Extreme Temperature Resistance: Operates stably from -60℃ to 220℃, absorbing thermal stress to protect chips and gold wires from high-temperature cycles.
3.  Strong Adhesion a Durability: Bonds well with aluminum, copper, stainless steel and other metals; low volatile content, high strength, ozone and chemical resistance.
4.  Two Curing Types: Addition Curing Silicone offers fast curing and low shrinkage; condensation curing type is cost-effective for general applications.
 
 Technical Specifications
 Curing Type: Addition curing / Condensation curing
 Operating Temperature Range: -60℃ to 220℃
 Core Properties: Waterproof, moisture-proof, flame-retardant, insulating, thermally conductive
 Adhesion Materials: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel
 Full Curing Time: 24 hours (room/heating temperature)
 
 How to Use
1.  Prepare: Stir Component A thoroughly to mix settled fillers; shake Component B well.
2.  Mix: Blend A and B according to the specified weight ratio.
3.  Deaerate (Optional): Place mixed glue in a vacuum container at 0.01MPa for 3 minutes.
4.  Potting: Pour the treated glue onto electronic components.
5.  Cure: Let it cure at room or heated temperature; proceed to next process after initial curing.
 
 Application Scenarios
Ideal for encapsulation, sealing and filling of electronic components, widely used in LED displays, CPU equipment, power supplies, communication devices and industrial control modules. It helps improve product reliability, extend service life and reduce maintenance costs for electronics manufacturers worldwide.
 
 Certifications and Compliance
Our products comply with international standards, with the company holding ISO9001, UL and CE certifications. This ensures that our Electronic Potting Compound meets global quality and safety requirements for cross-border trade.
 
 Customization Options
We offer customized solutions based on your needs. Hardness, viscosity and operation time of the cured product can be adjusted to match specific application scenarios, supporting OEM services for bulk orders.
 
 Production Process
The product undergoes strict quality control: raw material inspection → precise formulation mixing → automated production on 20+ lines → pre-production sampling → final inspection before shipment. Our professional QC team ensures consistent quality, backed by over 20 years of silicone manufacturing experience.
 
 FAQ
Q1: Can the product be used for high-power electronic devices?
A1: Yes, its thermal conductivity and high-temperature resistance make it suitable for high-power components.
 
Q2: How to store unused potting compound?
A2: Seal the components tightly; mixed glue must be used up at once to avoid waste.
 
Q3: What if the glue is layered after storage?
A3: Stir it thoroughly before use—this will not affect the product performance.
 
Q4: Is the product harmful to human body?
A4: It is non-hazardous, but avoid contact with mouth and eyes; rinse with water immediately if accidental contact occurs.
 
Q5: Can I get a sample before bulk purchase?
A5: Yes, we provide free samples with freight collect for your testing and evaluation.
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