HONG YE SILICONE Electronic Potting is a high-performance Silicone Potting Compound designed for underwater connector assemblies, a coreSilicone raw material with excellent underwater waterproof, seawater corrosion resistance and wide temperature adaptability (-60℃ to 220℃). As a premium Electronic Encapsulation Adhesive, this dual-component Addition Curing Silicone features low volatility, high strength and superior adhesion. Fully complying with ISO, CE and RoHS certifications, it reliably protects underwater connector components, ensuring stable signal transmission and long-term operation in harsh underwater environments, meeting global underwater electronic equipment manufacturer demands.
Product Overview
Our Electronic Potting, also called potting glue or encapsulation silicone, is a professional Silicone Encapsulant specially engineered for underwater connector assemblies—the core component ensuring reliable signal and power transmission in underwater scenarios. As a professional supplier of Thermally Conductive Potting Compound and industrial silicone solutions, we optimize this product for underwater use: it is a dual-component liquid silicone that cures into a solid after adding curing agent, with excellent waterproof, moisture-proof, corrosion-resistant and insulation performance. It bonds perfectly to PC, PMMA, PCB and underwater-grade metals (aluminum, copper, stainless steel), effectively isolating seawater, moisture and corrosion, protecting connector components from damage. Technical Specifications
Our Electronic Potting has stable underwater performance with fully customizable parameters: dual-component Addition Curing Silicone, A/B weight ratio adjustable, liquid before curing, requiring thorough stirring of Component A (to mix settled fillers) and shaking of Component B before mixing. Optional vacuum defoaming at 0.01MPa for 3 minutes before pouring, supports room-temperature or heated curing, basic curing for next process, full curing within 24 hours (temperature and humidity affect curing). It operates continuously from -60℃ to 220℃, low volatility, high strength, excellent adhesion to metals and electronic materials, with superior insulation and thermal conductivity. Shelf life is 12 months (sealed storage), non-hazardous for transportation.
Product Features & Advantages
- Superior Underwater Waterproof Performance: Excellent sealing and waterproof ability, effectively isolating seawater, moisture and water pressure, preventing water intrusion into connectors, avoiding short circuits and component damage.
- Seawater Corrosion Resistance: Strong resistance to seawater erosion, salt fog and marine chemicals, no aging or degradation in long-term underwater use, ensuring connector service life.
- Wide Temperature Adaptability: Stable operation from -60℃ to 220℃, adapting to extreme temperature changes in shallow and deep water environments, avoiding performance loss in low or high temperature.
- High Strength & Superior Adhesion: Low volatility, high structural strength after curing, bonds firmly to underwater connector materials (metals, PC, PCB), no detachment even under water pressure and vibration.
- Excellent Insulation & Signal Protection: Superior insulation performance, no interference to signal transmission of underwater connectors, ensuring stable power and signal transmission in underwater scenarios.
- Dual Curing & Customizable: Available in addition-curing and condensation-curing types, adjustable hardness, viscosity and operating time, adapting to different underwater connector sizes and production processes.
How to Use (Step-by-Step)
- Pre-Mix Preparation: Thoroughly stir Component A to mix settled fillers evenly, shake Component B thoroughly; slight stratification during storage does not affect performance after stirring.
- Component Mixing: Strictly mix A and B according to the specified weight ratio, stir continuously until homogeneous to ensure optimal waterproof and curing performance.
- Vacuum Defoaming: If needed, place the mixed glue in a vacuum container and defoam at 0.01MPa for 3 minutes to remove bubbles, ensuring dense, bubble-free encapsulation without water seepage gaps.
- Curing Process: Pour the defoamed glue into underwater connector assemblies, cure at room temperature or heat. Proceed to the next process after basic curing; full curing (24 hours) ensures optimal underwater protection.
Application Scenarios
This Electronic Potting is specifically for underwater connector assemblies, including marine underwater connectors, underwater sensor connectors, subsea communication connectors and underwater power connectors, widely used in marine exploration, underwater surveillance, offshore engineering and underwater robotics. It is suitable for encapsulating connector cores, pins and electronic components. For underwater equipment purchasers, it enhances connector reliability, reduces failure rates from seawater corrosion and water intrusion, extends service life, ensures stable signal transmission, lowers maintenance costs and boosts competitiveness in the global underwater electronic equipment market.
Customization Options
We provide full customization for underwater connector assembly requirements:
- Adjust curing hardness, viscosity and operating time to match different underwater connector sizes and assembly processes.
- Optimize waterproof performance and corrosion resistance to adapt to different underwater depths (shallow water, deep sea) and marine environments.
- Customize A/B mixing ratio and curing speed to meet underwater connector mass production needs.
- Provide flexible packaging to meet small-batch R&D and large-scale production supply needs.
Certifications & Compliance
Our Electronic Potting meets international underwater electronic equipment and industrial standards, holding ISO 9001, CE and RoHS certifications. It has stable batch performance, non-toxic, environmentally friendly, undergoes strict quality testing (waterproof, corrosion resistance, temperature adaptability), widely trusted by global underwater connector manufacturers and suppliers.
Production Process
Our production adheres to strict industrial and underwater-grade standards: selecting high-purity Silicone raw materials, precise A/B component mixing, vacuum defoaming, strict viscosity and strength testing, professional sealed packaging. Each batch undergoes rigorous underwater performance testing to ensure it meets underwater connector assembly application requirements, demonstrating our strong production capacity and quality assurance system. FAQ
Q: Is this potting suitable for deep-sea underwater connectors?
A: Yes. It has superior waterproof performance and pressure resistance, adapting to deep-sea water pressure, effectively isolating seawater and protecting connector components from corrosion and damage.
Q: How to store this potting silicone properly?
A: Seal and store in a cool, dry place; mixed glue should be used at one time. Stir evenly if stratified, which does not affect performance. It is non-hazardous and can be transported as general chemicals.
Q: Can it withstand extreme temperature changes in underwater environments?
A: Yes. It operates stably from -60℃ to 220℃, adapting to extreme temperature fluctuations in shallow and deep water, ensuring no performance loss in cold or high-temperature underwater environments.
Q: Can it be customized for different underwater connector models?
A: Yes. We can customize hardness, viscosity and waterproof performance to match your underwater connector model, assembly process and underwater application environment.
Shenzhen Hong Ye Jie Technology Co., Ltd
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