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Home> Products> Electronic Potting Compound> Electronic Potting for Atomic Clocks
Electronic Potting for Atomic Clocks
Electronic Potting for Atomic Clocks
Electronic Potting for Atomic Clocks
Electronic Potting for Atomic Clocks
Electronic Potting for Atomic Clocks
Electronic Potting for Atomic Clocks

Electronic Potting for Atomic Clocks

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9055

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting
Product Description
HONG YE SILICONE Electronic Potting Compound for Atomic Clocks is a high-precision two-component Addition Curing Silicone, also known as Silicone Encapsulant and Electronic Encapsulation Adhesive, tailored for atomic clock equipment. Crafted from high-purity Silicone raw materials, it features adjustable weight mixing ratio, ultra-low viscosity, minimal signal interference, and temperature adaptability (-60℃ to 220℃). It cures at room or heated temperatures, adheres well to PC, PMMA, PCB and metals, protects core atomic clock components, ensures ultra-high precision timekeeping, complies with EU RoHS, and supports full parameter customization (around 198 characters).
 
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Product Overview

Our Electronic Potting Compound is specially developed for Atomic Clocks, dedicated to encapsulating, sealing, insulating and protecting atomic clock oscillators, frequency control modules, PCB substrates, precision chips and signal transmission components. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for ultra-high-precision timekeeping scenarios, enhancing low signal interference, high stability and environmental adaptability to adapt to the extreme precision, low-noise operation requirements of atomic clocks. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, low shrinkage, and absorbs thermal stress, ensuring long-term reliable operation of atomic clock components in laboratories, aerospace and navigation fields.
 
electronic potting

Key Features & Advantages

  1. Ultra-Low Signal Interference: Optimized formula with ultra-low dielectric loss and minimal electromagnetic interference, avoiding interference with atomic clock frequency signals and oscillator operation, ensuring ultra-high precision timekeeping performance (critical for atomic clock accuracy).
  2. Superior Stability & Temperature Adaptability: Stable performance from -60℃ to 220℃, withstanding minimal temperature fluctuations; effectively absorbing thermal stress generated by component operation, avoiding deformation of precision parts and ensuring consistent timekeeping accuracy.
  3. High Insulation & Purity: High volume resistivity (≥1.0×10¹⁶ Ω·cm), excellent dielectric strength, isolating internal and external static and interference; minimal volatile content, no harmful residues, ensuring the cleanliness of atomic clock internal precision components.
  4. Precision Curing & Easy Operation: Adjustable weight mixing ratio, easy to proportion and stir; curable at room or heated temperatures, fully cured in 24 hours; optional vacuum degassing (0.01MPa for 3 minutes) to eliminate air bubbles, ensuring full penetration into tiny gaps of precision components.
  5. Strong Adhesion & Customizability: Excellent adhesion to PC, PMMA, PCB, aluminum, copper and stainless steel, ensuring tight sealing of atomic clock components; as a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity, operation time and interference resistance to match different atomic clock models.

How to Use

  1. Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects insulation and signal interference performance.
  2. Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause signal distortion and affect timekeeping precision.
  3. Degassing: After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, ensuring full penetration into tiny gaps of atomic clock precision components.
  4. Curing: Pour the degassed mixture into component housings; cure at room temperature or heat to accelerate, enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed.

Application Scenarios

This specialized silicone potting compound is exclusively for Atomic Clocks, including cesium atomic clocks, rubidium atomic clocks, and precision atomic clock modules. It is suitable for encapsulating atomic clock oscillators, frequency control modules and precision chips, ensuring stable operation in aerospace navigation, scientific research laboratories, satellite communication and timekeeping systems. It enhances atomic clock timekeeping precision, extends service life in harsh environments, and is compatible with Rapid prototyping silicone to accelerate new atomic clock product R&D.

Technical Specifications

Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (ultra-low option available); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Dielectric Loss: Ultra-low; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.

Certifications & Compliance

Our Electronic Potting Compound complies with international precision instrument, aerospace and safety standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global atomic clock safety and performance requirements, trusted by global scientific research and aerospace equipment procurement partners.

Customization Options

We provide atomic clock-specific tailored solutions: custom formulations (adjust signal interference resistance, viscosity and curing speed), ultra-low viscosity optimization for precision component gaps, and small-batch packaging to meet large-scale production and R&D needs of atomic clock manufacturers.

Production Process & Quality Control

We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, signal interference, adhesion), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global atomic clock orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when stored in a cool, dry place.

FAQ

Q: Is it suitable for rubidium/cesium atomic clocks?
A: Yes, it has ultra-low signal interference, adapting to atomic clock ultra-high precision timekeeping requirements.
Q: Will it affect atomic clock accuracy?
A: No, its ultra-low dielectric loss ensures stable frequency signal transmission and precise timekeeping.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: How to handle stratified colloid?
A: Stir evenly before use; performance remains unaffected.
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