Product Overview
Our Thermally Conductive Electronic Potting Compound is specially developed for Electromagnetic Railguns, dedicated to encapsulating, sealing, insulating and heat-dissipating railgun power modules, control boards, signal transmitters and high-voltage components. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for high-temperature, high-voltage and high-impact railgun working scenarios, enhancing thermal conductivity, flame retardancy and impact resistance to adapt to the harsh operation requirements of electromagnetic railguns. Compared with epoxy potting resin, it has excellent low-temperature flexibility, no exotherm during curing, low shrinkage, and effectively extends the service life of railgun electronic components.
Key Features & Advantages
- Excellent Thermal Conductivity: Thermal conductivity ≥0.8 W/(m·K), efficiently transferring heat generated by railgun power modules and high-voltage components during operation, avoiding overheating and ensuring stable equipment performance.
- Top-Level Flame Retardancy: Meets UL94-V0 flame retardant standard, effectively preventing fire spread, adapting to high-voltage and high-temperature working environments of electromagnetic railguns, and ensuring operational safety.
- Superior Insulation & Waterproof Performance: High volume resistivity (≥1.0×10¹⁶ Ω·cm), dielectric strength ≥25 kV/mm, achieving IP65 waterproof level; isolating internal and external interference, preventing short circuits caused by moisture and dust, protecting precision components.
- Wide Temperature Adaptability & Impact Resistance: Stable performance from -60℃ to 220℃, withstanding extreme temperature fluctuations; curing into a soft rubber state, excellent impact resistance, absorbing vibration and impact generated by railgun launch, avoiding component damage.
- Easy Operation & Customizability: 1:1 weight mixing ratio, low viscosity and good fluidity, easy to stir and pour; curable at room or heated temperatures (80℃ for 20 hours, 80-100℃ for 15 minutes); as a professional Silicone Potting Compound manufacturer, we customize thermal conductivity, hardness, viscosity and operation time to match different railgun models.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A and Component B in their respective containers to ensure uniform distribution of fillers, avoiding stratification that affects thermal conductivity and flame retardancy.
- Precision Mixing: Strictly follow the 1:1 weight ratio of Component A to Component B, stirring slowly and evenly to ensure full integration without air bubbles that cause heat accumulation and insulation defects.
- Degassing: After mixing, place the adhesive in a vacuum container at 0.08MPa for 5 minutes to eliminate air bubbles, ensuring full penetration into tiny gaps of railgun electronic components.
- Curing: Pour the degassed mixture into component housings; cure at room temperature (4-5 hours) or heat to 80-100℃ to accelerate (15 minutes). Note: Curing time extends with thicker application; winter low temperatures recommend heating curing.
Application Scenarios
This specialized thermally conductive potting compound is exclusively for Electromagnetic Railguns, including military electromagnetic railguns, experimental railguns and industrial railgun equipment. It is suitable for encapsulating railgun power modules, control boards, signal transmitters, high-voltage terminals and precision chips, ensuring stable operation in military, aerospace and experimental fields. It enhances heat dissipation efficiency of railgun components, improves equipment stability, extends service life, and is compatible with Rapid prototyping silicone to accelerate new railgun product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): 1:1 (weight ratio); Appearance: Liquid (both components); Viscosity (cps): 500±100 (each component, HY-9315); Mixed Viscosity (cps): 500±100; Operation Time: 0.5-2 hours; Curing Time: 4-5 hours (room temperature), 20 hours (80℃), 15 minutes (80-100℃); Hardness (Shore A): 15±5; Thermal Conductivity: ≥0.8 W/(m·K); Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Flame Retardancy: UL94-V0; Waterproof Level: IP65; Compliance: EU RoHS; Shelf Life: 12 months (below 25℃); Packaging: 5kg, 20kg, 25kg, 200kg. All key parameters are fully customizable.
Certifications & Compliance
Our Thermally Conductive Electronic Potting Compound complies with international military equipment, high-voltage safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, UL94-V0 Flame Retardant Certification, meeting global electromagnetic railgun safety and performance requirements, trusted by global military and high-end equipment procurement partners.
Customization Options
We provide electromagnetic railgun-specific tailored solutions: custom formulations (adjust thermal conductivity, flame retardancy, viscosity and curing speed), 1:1 ratio optimization, and flexible packaging to meet large-scale production and small-batch experimental needs of railgun manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (thermal conductivity, flame retardancy, insulation), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global electromagnetic railgun orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when stored in a cool, dry place.
FAQ
Q: Is it suitable for military electromagnetic railguns?
A: Yes, it has UL94-V0 flame retardancy and high insulation, adapting to harsh military railgun working environments.
Q: What’s the thermal conductivity?
A: ≥0.8 W/(m·K), customizable for higher heat dissipation needs.
Q: Can it be cured quickly?
A: Yes, 15 minutes at 80-100℃, 4-5 hours at room temperature.
Q: Shelf life?
A: 12 months when sealed and stored below 25℃.
Q: How to handle thick application curing?
A: Extend curing time or adopt heating curing to ensure full curing.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
