Product Overview
Our Electronic Potting Compound (liquid conductive silicone) is specially developed for Electrochemical Workstations, dedicated to encapsulating, sealing, thermally conducting and insulating workstation control modules, circuit boards, electrode connectors and power modules. As a leading manufacturer of liquid silicone and Addition Curing Silicone, we optimize the formula for precision electrochemical testing scenarios, enhancing thermal conductivity, insulation and chemical corrosion resistance to adapt to the strict stability requirements of workstations. Compared with epoxy potting resin, it cures without exotherm, has no corrosion, low shrinkage, and avoids damaging sensitive electrochemical components, ensuring stable test data and long-term reliable operation.
Key Features & Advantages
- Excellent Thermal Conductivity & Insulation: Thermal conductivity ≥0.8 W/(m·K), effectively dissipating heat generated by workstation components during long-term operation; volume resistivity ≥1.0×10¹⁶ Ω·cm, dielectric strength ≥25 kV/mm, ensuring safe insulation and avoiding short circuits or signal interference.
- Superior Corrosion & Environment Resistance: Excellent resistance to chemical media, waterproof, moisture-proof, mold-proof and dust-proof, adapting to the corrosive environment of electrochemical testing; good weather resistance and anti-yellowing performance, extending the service life of workstation components.
- Easy Operation & Fast Curing: Curable at room temperature (4-5 hours) or heated (80℃ for 20 minutes), 1:1 weight mixing ratio, easy to stir and operate; optional vacuum degassing (0.08MPa for 3 minutes) to eliminate air bubbles, improving encapsulation quality and production efficiency.
- Non-Corrosive & Low Shrinkage: Cures without exotherm or corrosive substances, protecting sensitive electrochemical components and circuit boards from damage; low shrinkage, ensuring tight bonding with substrates and no component deformation.
- Customizable & Flame-Retardant: As a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity, thermal conductivity and curing speed to match different workstation models; UL94-V1 flame retardancy meets high safety requirements.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A (dark gray fluid) and Component B (white fluid) in their respective containers to ensure uniform mixing of fillers and avoid stratification that affects performance.
- Precision Mixing: Strictly follow the 1:1 weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause component damage or performance degradation.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.08MPa for 3 minutes to eliminate air bubbles, then pour it into electrochemical workstation components for encapsulation.
- Curing: Cure at room temperature (4-5 hours) or heat to accelerate curing (80℃ for 20 minutes); note that curing effect is greatly affected by temperature, and proper heating can speed up vulcanization in low-temperature environments.
Application Scenarios
This specialized electronic potting compound is exclusively for Electrochemical Workstations, including laboratory electrochemical workstations, industrial electrochemical testing equipment, and research-grade electrochemical analysis systems. It is suitable for encapsulating control modules, circuit boards, electrode connectors and power modules, ensuring stable operation in chemical laboratories, material research, industrial quality inspection and environmental monitoring fields. It enhances workstation operational stability, reduces test data deviation, extends service life, and is compatible with Rapid prototyping silicone to accelerate new workstation product R&D. Technical Specifications
Model (Reference): HY-9055; Curing Type: Addition-Curing; Mix Ratio (A:B): 1:1 (weight ratio); Appearance: Component A (dark gray fluid), Component B (white fluid); Viscosity: 3000±500 mPa·s; Hardness (Shore A): 55±5; Operation Time (25℃): 30-60 minutes; Curing Time (25℃): 4-5 hours,( 68758912,80℃): 20 minutes; Thermal Conductivity: ≥0.8 W/(m·K); Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Flame Retardancy: UL94-V1; Compliance: EU RoHS; Shelf Life: 12 months; Packaging: 5kg, 20kg, 25kg, 200kg. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electrochemical equipment, laboratory safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, UL94-V1 Flame Retardant Certification, meeting global electrochemical workstation safety and performance requirements, trusted by global laboratory, research and industrial procurement partners.
Customization Options
We provide workstation-specific tailored solutions: custom formulations (adjust thermal conductivity, viscosity, operation time and curing speed), 1:1 ratio optimization, and flexible packaging to meet large-scale production and laboratory R&D needs of electrochemical workstation manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (thermal conductivity, insulation, corrosion resistance), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for laboratory electrochemical workstations?
A: Yes, it has excellent insulation and corrosion resistance, adapting to laboratory testing environments.
Q: What’s the mixing ratio?
A: 1:1 weight ratio for Component A and B.
Q: Will it corrode sensitive components?
A: No, it cures without exotherm and no corrosion, protecting sensitive components.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: How to handle stratified colloid?
A: Stir evenly before use; performance remains unaffected.
Shenzhen Hong Ye Jie Technology Co., Ltd
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