Product Overview
Our Electronic Potting Compound (waterproof and insulating electronic silicone) is specially developed for Differential Mobility Analyzers, dedicated to encapsulating, sealing, insulating and protecting DMA signal detection modules, circuit boards, precision connectors and ion mobility channels. As a leading manufacturer of liquid silicone and RTV 2 Silicone Rubber, we optimize the formula for high-precision DMA particle analysis scenarios, enhancing ultra-high insulation, low signal interference, and rapid deep curing to adapt to the strict accuracy requirements of DMAs. Compared with epoxy potting resin, it has low viscosity, excellent fluidity, no harmful substances, and good elasticity, avoiding damage to fragile DMA components and ensuring accurate particle mobility analysis results.
Key Features & Advantages
- Ultra-High Insulation & Low Signal Interference: Volume resistivity ≥1.0×10¹⁶ Ω·cm, dielectric strength ≥25 kV/mm, effectively isolating external electrical interference; low signal attenuation, avoiding interference with DMA ion mobility detection, ensuring accurate and stable analysis data.
- Excellent Waterproof & Sealing Performance: Superior waterproof and moisture-proof performance, tightly sealing DMA internal components, preventing dust, moisture and external contaminants from entering, ensuring stable operation in laboratory and industrial analysis environments.
- Rapid Room-Temperature Curing & Easy Operation: Room-temperature curing (full curing in 24 hours, initial curing in 3-5 minutes), 30-120 minutes of operation time, 1:1 weight mixing ratio, easy to stir and use; optional vacuum degassing (0.08MPa for 3 minutes) to eliminate air bubbles, improving encapsulation efficiency.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PC, PP, ABS, PVC and various metals, ensuring tight bonding with DMA components; low viscosity and good fluidity, easily filling tiny gaps of precision DMA parts.
- Flame-Retardant & Customizable: UL94-V1 flame retardancy, meeting high safety standards for electronic equipment; as a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity, curing speed and flame retardancy to match different DMA models.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A (viscous liquid) to evenly distribute settled black pigment, and shake Component B (viscous liquid) vigorously to ensure uniformity, avoiding stratification that affects insulation performance.
- Precision Mixing: Strictly follow the 1:1 weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause component damage or signal interference.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.08MPa for 3 minutes to eliminate air bubbles, then pour it into DMA components for encapsulation, ensuring full coverage of core parts.
- Curing: Place the encapsulated DMAs at room temperature for curing; enter the next process after initial curing (3-5 minutes), and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specialized electronic potting compound is exclusively for Differential Mobility Analyzers, including laboratory DMAs, industrial particle analysis DMAs, environmental monitoring DMAs and aerosol analysis equipment. It is suitable for encapsulating DMA signal detection modules, circuit boards, precision connectors and ion mobility channels, ensuring stable operation in environmental monitoring, aerosol research, industrial quality inspection and laboratory analysis fields. It enhances DMA analysis accuracy, reduces component failure rate, extends service life, and is compatible withRapid prototyping silicone to accelerate new DMA product R&D. Technical Specifications
Model (Reference): HY-9325; Curing Type: RTV Room-Temperature Vulcanization; Mix Ratio (A:B): 1:1 (weight ratio); Appearance: Viscous liquid (both components); Viscosity: 500±100 cps; Operation Time (25℃): 30-120 minutes; Curing Time: 3-5 minutes (initial), 24 hours (full); Hardness (Shore A): 25±2; Thermal Conductivity: ≥0.2 W/(m·K); Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Flame Retardancy: UL94-V1; Compliance: EU RoHS; Shelf Life: 1 year; Packaging: 5kg, 20kg, 25kg, 200kg (iron drum); 20kg (plastic drum). All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international analysis equipment, electronic safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, UL94-V1 Flame Retardant Certification, meeting global DMA safety and performance requirements, trusted by global research institutions, industrial and laboratory equipment procurement partners.
Customization Options
We provide DMA-specific tailored solutions: custom formulations (adjust insulation, viscosity and curing speed), low signal interference optimization, and flexible packaging (iron/plastic drum) to meet large-scale production and laboratory R&D needs of DMA manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, waterproof, flame retardancy), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global DMA orders. The product is non-hazardous, transportable as general chemicals, and has a 1-year shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for laboratory DMAs?
A: Yes, it has ultra-high insulation and low signal interference, adapting to high-precision DMA particle analysis requirements.
Q: What’s the operation time?
A: 30-120 minutes at 25℃, sufficient for precision encapsulation.
Q: Can it be used for metal and plastic DMA components?
A: Yes, it has excellent adhesion to various metals and plastics like PC, ABS.
Q: Shelf life?
A: 1 year when sealed and stored properly.
Q: How to handle stratified colloid?
A: Stir evenly before use; performance remains unaffected.
Shenzhen Hong Ye Jie Technology Co., Ltd
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