Product Overview
Our Electronic Potting Compound is specially developed for Multi-Chip Modules (MCMs), dedicated to encapsulating, sealing, insulating and protecting high-density integrated MCMs, chip stacks, interconnections and delicate bonding points. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for MCM’s dense integration, enhancing fine gap penetration, low signal interference and thermal stability. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, low shrinkage, and good flexibility, avoiding damage to fragile interconnections and ensuring stable MCM operation.
Key Features & Advantages
- Low Viscosity & Dense Gap Penetration: Customizable low viscosity formula, excellent fluidity, easily filling tiny gaps between multiple chips, bonding points and interconnections in MCMs, ensuring full encapsulation without dead corners, critical for high-density integration protection.
- Excellent Thermal Stability & Stress Absorption: Stable performance from -60℃ to 220℃, effectively dissipating heat generated by multiple chips; absorbs thermal stress caused by high-temperature cycles, protecting chips, welding gold wires and interconnections from damage, extending MCM service life.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PC, PCB, aluminum, copper and stainless steel, tightly bonding multiple chips, substrates and interconnections; no corrosion or damage to delicate components, ensuring firm and long-lasting encapsulation without peeling.
- Low Interference & High Insulation: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), isolating adjacent chips and interconnections, avoiding signal crosstalk and electromagnetic interference, ensuring stable MCM performance.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and curing speed to match different MCM sizes and integration densities.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects gap penetration and adhesion to MCM chips and interconnections.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause short circuits or signal interference between chips.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto MCMs to ensure full infiltration of tiny gaps between chips.
- Curing: Place the encapsulated MCMs at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and bonding performance.
Application Scenarios
This specialized electronic potting compound is widely used for Multi-Chip Modules (MCMs), including high-density integrated circuits, chip stacks, power MCMs, communication MCMs and automotive electronic modules. It is suitable for industries such as aerospace, consumer electronics, industrial control and medical equipment, ensuring stable operation of MCMs in compact, high-performance devices. It enhances MCM reliability, reduces chip failure rate, improves integration stability, and is compatible with Rapid prototyping silicone to accelerate new MCM product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (low for dense gaps); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international high-integration electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global MCM production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide MCM-specific tailored solutions: custom formulations (adjust viscosity for dense gaps, insulation and curing speed), anti-interference optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (viscosity, adhesion, thermal stability), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for high-density MCMs with tiny gaps?
A: Yes, it has low viscosity and excellent gap penetration, adapting to dense chip layouts and tiny interconnection gaps.
Q: Will it damage MCM interconnections?
A: No, it has no exotherm and low shrinkage, avoiding damage to delicate bonding points.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for specific MCM sizes?
A: Yes, we adjust viscosity and hardness to match different MCM integration densities.
Shenzhen Hong Ye Jie Technology Co., Ltd
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