HONG YE SILICONE Electronic Potting Compound for Through-Silicon Vias (TSV) is a high-precision two-component Addition Curing Silicone, also known as Silicone Encapsulant and electronic Potting Compound, tailored for TSV protection. Crafted from high-purity Silicone raw materials, it features adjustable weight mixing ratio, ultra-low viscosity, excellent temperature resistance (-60℃ to 220℃), strong adhesion and low shrinkage. It cures at room or heated temperatures, fills TSV tiny holes, ensures insulation and heat dissipation, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Compound is specially developed for Through-Silicon Vias (TSV), dedicated to encapsulating, sealing, filling, insulating and thermally conducting TSV tiny holes, chips and interconnections. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for TSV’s ultra-fine hole structure, enhancing precise hole filling, low curing stress and excellent adhesion. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, good flexibility, avoiding damage to TSV structures and ensuring stable signal transmission and heat dissipation. Key Features & Advantages
- Ultra-Low Viscosity & Precise TSV Filling: Customizable ultra-low viscosity formula, excellent fluidity, easily filling TSV tiny holes and gaps between TSV structures and chips, ensuring full filling without air bubbles, critical for TSV’s signal transmission and structural stability.
- Excellent Thermal Stability & Stress Absorption: Stable performance from -60℃ to 220℃, effectively dissipating heat generated by TSV interconnections during operation; absorbs thermal stress caused by high-temperature cycles, protecting TSV holes, chips and welding gold wires from damage, extending service life.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to silicon wafers, PC, PCB, aluminum, copper and stainless steel, tightly bonding TSV structures to substrates; no corrosion to delicate TSV components, ensuring firm and long-lasting encapsulation without peeling.
- High Insulation & Anti-Interference: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), isolating TSV interconnections, avoiding signal crosstalk and electromagnetic interference, ensuring stable TSV signal transmission.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving TSV encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and curing speed to match different TSV hole sizes and specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects TSV hole filling and adhesion to silicon wafers.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that block TSV holes or cause signal interference.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto TSV structures to ensure full infiltration of tiny holes and gaps.
- Curing: Place the encapsulated TSV components at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and bonding performance.
Application Scenarios
This specialized electronic potting compound is widely used for Through-Silicon Vias (TSV), including high-density integrated circuits, silicon wafers, microchips, power modules and advanced electronic devices. It is suitable for industries such as consumer electronics, automotive electronics, aerospace and medical equipment, ensuring stable operation of TSV structures in high-precision, compact devices. It enhances TSV reliability, reduces component failure rate, improves signal transmission stability, and is compatible with Rapid prototyping silicone to accelerate new TSV product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (ultra-low for TSV holes); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: Silicon wafers, PC, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global through-silicon via production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide TSV-specific tailored solutions: custom formulations (adjust viscosity for TSV hole filling, insulation and curing speed), low-stress optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (viscosity, adhesion, thermal stability), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for filling tiny TSV holes?
A: Yes, it has ultra-low viscosity and excellent fluidity, adapting to various TSV hole sizes and ensuring full filling.
Q: Will it damage TSV structures?
A: No, it has no exotherm and low shrinkage, avoiding damage to delicate TSV holes and interconnections.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for specific TSV specifications?
A: Yes, we adjust viscosity and hardness to match different TSV hole sizes and integration needs.
Shenzhen Hong Ye Jie Technology Co., Ltd
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