HONG YE SILICONE Electronic Potting Compound for Crystal Oscillator Circuits is a high-stability two-component Addition Curing Silicone, also known as Silicone Encapsulant and electronic Potting Compound, tailored for crystal oscillator circuit protection. Crafted from high-puritySilicone raw materials, it features adjustable weight mixing ratio, ultra-low curing stress, excellent temperature resistance (-60℃ to 220℃), strong adhesion and minimal volatility. It cures at room or heated temperatures, prevents frequency drift, ensures insulation and stability, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Compound is specially developed for Crystal Oscillator Circuits, dedicated to encapsulating, sealing, insulating and protecting crystal oscillators, oscillator chips, resonant cavities and their solder joints. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for the high sensitivity and frequency stability of crystal oscillator circuits, enhancing low curing stress, anti-interference and excellent adhesion. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, good flexibility, avoiding crystal damage and ensuring stable oscillation frequency.
Key Features & Advantages
- Ultra-Low Curing Stress & No Frequency Drift: Customizable low-stress formula, cures without exotherm, minimal shrinkage rate, effectively avoiding mechanical stress on crystal oscillators, preventing frequency drift and ensuring long-term oscillation stability of crystal circuits.
- Superior Insulation & Anti-Interference: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), ensuring excellent insulation between oscillator components; effectively isolating external electromagnetic interference and voltage fluctuations, maintaining stable oscillation performance.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PCB, PC, aluminum, copper, stainless steel and crystal substrates, tightly bonding crystal oscillator circuits and substrates; no corrosion to crystal elements, ensuring firm and long-lasting encapsulation without peeling.
- Excellent Temperature Stability: Stable performance from -60℃ to 220℃, resisting extreme temperature changes, no deformation or performance degradation, adapting to various working environments and ensuring consistent oscillation frequency in harsh temperature conditions.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and curing speed to match different crystal oscillator circuit specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and oscillator frequency stability.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause insulation gaps or oscillator short circuits.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto crystal oscillator circuits to ensure full coverage of crystal elements and solder joints.
- Curing: Place the encapsulated crystal oscillator circuits at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and oscillation stability.
Application Scenarios
This specialized electronic potting compound is widely used for Crystal Oscillator Circuits, including consumer electronics (smartphones, computers), automotive electronics (in-vehicle control systems), industrial control (precision timing modules), medical devices and communication equipment. It is ideal for encapsulating crystal oscillators, resonant cavities and related components, ensuring stable oscillation frequency in high-precision timing scenarios. It enhances oscillator circuit reliability, reduces frequency drift rate, improves environmental adaptability, and is compatible with Rapid prototyping silicone to accelerate new crystal oscillator product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for oscillator coverage); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PCB, PC, aluminum, copper, stainless steel, crystal substrates; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global crystal oscillator circuit production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide crystal oscillator circuit-specific tailored solutions: custom formulations (adjust curing stress, viscosity, hardness and curing speed), anti-frequency drift optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-puritysilicone raw materials screening, precision automated formulation mixing, performance testing (curing stress, adhesion, insulation), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for high-precision crystal oscillator circuits?
A: Yes, it has ultra-low curing stress, avoiding frequency drift and ensuring long-term oscillation stability.
Q: Will it damage delicate crystal elements?
A: No, it has no exotherm and no corrosion, protecting fragile crystal components.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for specific oscillator circuits?
A: Yes, we adjust curing stress and viscosity to match different crystal oscillator specifications.
Shenzhen Hong Ye Jie Technology Co., Ltd
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