Product Overview
Our Electronic Potting Compound is specially developed for Thin-Film Resistor Networks, dedicated to encapsulating, sealing, insulating and protecting thin-film resistor arrays, their solder joints and PCB-mounted areas. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for the high Resistance value precision and fragile thin-film structure needs, enhancing low curing stress, anti-interference and excellent adhesion. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, good flexibility, avoiding resistor damage and Resistance value drift. Key Features & Advantages
- Ultra-Low Curing Stress & No Resistance value Drift: Customizable low-stress formula, cures without exotherm, minimal shrinkage rate, effectively absorbing thermal and mechanical stress, protecting fragile thin-film structures from damage and ensuring long-term Resistance value Resistance value precision of resistor networks.
- Superior Insulation & Anti-Interference: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), ensuring excellent insulation between thin-film resistor elements; effectively isolating external electromagnetic interference, avoiding Resistance value deviation caused by interference.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PCB, PC, aluminum, copper, stainless steel and thin-film substrates, tightly bonding thin-film resistor networks to PCBs; no corrosion to thin-film layers or metal electrodes, ensuring firm and long-lasting encapsulation without peeling.
- Excellent Temperature & Environmental Stability: Stable performance from -60℃ to 220℃, resisting extreme temperature cycles and harsh environments; waterproof, moisture-proof, dust-proof and anti-corrosive, adapting to automotive, industrial and high-precision electronic working conditions.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and dielectric properties to match different thin-film resistor network specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and resistor network precision.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause insulation gaps or stress concentration on thin-film resistors.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto thin-film resistor networks to ensure full coverage of resistors and solder joints without excessive pressure.
- Curing: Place the encapsulated thin-film resistor networks at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and resistor stability.
Application Scenarios
This specialized electronic potting compound is widely used for Thin-Film Resistor Networks in automotive electronics (in-vehicle precision control modules), industrial control (high-precision measurement equipment), consumer electronics (smartphones, test instruments), medical devices and communication equipment. It is ideal for encapsulating thin-film resistor arrays of all sizes, preventing damage and Resistance value drift, ensuring stable operation in high-precision electronic assemblies. It enhances resistor network reliability, reduces failure rate, improves environmental adaptability, and is compatible with Rapid prototyping silicone to accelerate new electronic product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for resistor network coverage); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Dielectric Loss: Low (customizable); Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PCB, PC, aluminum, copper, stainless steel, thin-film substrates; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global thin-film resistor network production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide thin-film resistor network-specific tailored solutions: custom formulations (adjust dielectric properties, viscosity, hardness and curing speed), anti-drift optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (dielectric properties, adhesion, anti-interference), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for fragile thin-film resistor networks?
A: Yes, it has ultra-low curing stress, effectively protecting thin-film structures and preventing Resistance value drift.
Q: Will it affect resistor Resistance value precision?
A: No, it has stable dielectric properties, no interference with thin-film resistor performance.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for different resistor networks?
A: Yes, we adjust dielectric properties and viscosity to match various thin-film resistor network specifications.
Shenzhen Hong Ye Jie Technology Co., Ltd
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