HONG YE SILICONE Electronic Potting Silicone for Quad Flat No-Lead Packages (QFN) is a high-performance two-component Addition Curing Silicone, also known as Silicone Encapsulant andElectronic Potting Compound, tailored for QFN protection. Crafted from high-purity Silicone raw materials, it features a 1:1 weight mixing ratio, no exotherm during curing, low shrinkage and excellent flexibility. It cures at room or heated temperatures, forms a soft rubber after curing, protects QFN chips and PCB pads from damage, ensures insulation and heat dissipation, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Silicone is specially developed for Quad Flat No-Lead Packages (QFN), dedicated to encapsulating, sealing, insulating and protecting QFN chips, PCB pads and surrounding components. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for QFN’s lead-free, compact structure and high heat dissipation needs, enhancing excellent adhesion, anti-impact performance and easy maintenance. Compared with epoxy potting resin, it has no exotherm, no corrosion, low shrinkage, and the glue layer can be easily peeled off for component maintenance, reducing after-sales costs.
Key Features & Advantages
- Gentle Curing & QFN Protection: Cures without exotherm, no corrosion to QFN chips and PCB pads, low shrinkage rate, forms a soft rubber after curing with good impact resistance, effectively protecting QFN from mechanical damage and environmental erosion, ensuring long-term stable operation.
- Superior Insulation & Multi-Functional Protection: Excellent waterproof, moisture-proof, anti-static and anti-chemical medium performance; high dielectric strength, ensuring reliable insulation between QFN and adjacent components, avoiding short circuits and signal interference; good weather resistance and anti-yellowing, extending product service life.
- Easy Maintenance & Strong Adhesion: The cured glue layer can be easily peeled off, facilitating maintenance and replacement of QFN components, reducing maintenance costs; excellent adhesion to PCB, aluminum, copper and QFN chip substrates, ensuring firm and long-lasting encapsulation without peeling.
- Excellent Temperature Stability: Stable performance in a wide temperature range (-60℃ to 220℃), no crystallization at low temperatures, resisting extreme temperature cycles and aging, adapting to automotive, industrial and consumer electronic working conditions, ensuring QFN stable operation in harsh environments.
- Easy Operation & Customizability: 1:1 weight mixing ratio, easy to operate and control; optional vacuum degassing (0.08MPa for 3 minutes) to avoid air bubbles; curable at room or heated temperatures, fully cured in 24 hours; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and operating time to match different QFN specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and QFN protection effect.
- Precision Mixing: Strictly follow the 1:1 weight ratio of Component A to Component B, stirring slowly and evenly to ensure full integration without air bubbles that cause insulation gaps.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.08MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto QFN assemblies to ensure full coverage of chips and PCB pads.
- Curing: Place the encapsulated QFN assemblies at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and QFN performance.
Application Scenarios
This specialized electronic Potting Compound is widely used for Quad Flat No-Lead Packages (QFN) in circuit boards, electronic ballasts, transformers, LEDs, LCDs, CPUs, electronic displays and other electronic products. It is suitable for automotive electronics, industrial control, consumer electronics, communication equipment and other fields, providing reliable encapsulation and protection for QFN. It enhances QFN reliability, reduces failure rate, extends service life, and is compatible with Rapid prototyping silicone to accelerate new QFN product R&D, helping procurement商 reduce production and maintenance costs. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): 1:1 (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: High; Curing Time: 24 hours (room temperature, heat-accelerated); Degassing Condition: 0.08MPa for 3 minutes; Features: No exotherm, low shrinkage, easy glue peeling, waterproof, moisture-proof, anti-static; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage); Main Models: HY-9055, HY-9045 (customizable models available).
Certifications & Compliance
Our Electronic Potting Silicone complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global QFN production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide QFN-specific tailored solutions: custom formulations (adjust viscosity, hardness, operating time and curing speed), heat dissipation optimization, and flexible parameter adjustment, meeting large-scale production and prototype R&D needs of different industries, adapting to various QFN specifications and application scenarios.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, adhesion, temperature resistance), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for all QFN packages?
A: Yes, it can be customized to match different QFN specifications, with good compatibility with QFN chips and PCB pads.
Q: What’s the mixing ratio?
A: 1:1 weight ratio, easy to operate.
Q: Can the glue layer be peeled off for maintenance?
A: Yes, the cured glue layer is soft and easy to peel, facilitating QFN component maintenance.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly, stratification during storage does not affect performance after stirring.
Shenzhen Hong Ye Jie Technology Co., Ltd
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