Product Overview
Our Electronic Potting Silicone is specially developed for Diamond Substrate Circuits, dedicated to encapsulating, sealing, insulating and heat-dissipating protection of diamond substrates, circuits, chips and solder joints. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for diamond substrates’ ultra-high thermal conductivity, high hardness and strong adhesion needs, enhancing excellent thermal matching, anti-vibration performance and environmental adaptability. Compared with epoxy potting resin, it has minimal volatile content, no exotherm, low shrinkage, and can absorb thermal stress to protect diamond substrate components and welding gold wires without damaging high-hardness diamond surfaces.
Key Features & Advantages
- High Thermal Conductivity & Thermal Matching: Optimized thermal conductive formula, perfectly matching diamond substrates’ ultra-high heat dissipation performance, efficiently guiding heat generated by circuits, avoiding local overheating damage; low shrinkage rate, curing without exotherm, reducing thermal stress between potting material and diamond substrate, ensuring long-term stable operation.
- Superior Insulation & Multi-Functional Protection: Excellent waterproof, moisture-proof, dust-proof and anti-corrosion performance; high dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), ensuring reliable insulation of diamond substrate circuits, avoiding short circuits and signal interference; good ozone resistance and anti-chemical erosion, adapting to harsh industrial and high-temperature working environments.
- Strong Adhesion & Diamond Compatibility: Outstanding adhesion to diamond substrates, PC, PMMA, PCB and metals (aluminum, copper, stainless steel), tightly bonding to high-hardness diamond surfaces without peeling; no corrosion to diamond materials, ensuring firm and long-lasting encapsulation, reducing diamond substrate circuit failure rate.
- Excellent Temperature Stability: Stable performance in a wide temperature range (-60℃ to 220℃), resisting extreme temperature cycles and aging, no crystallization at low temperatures, perfectly adapting to diamond substrates’ high-temperature working scenarios in high-power electronics, aerospace and precision instruments.
- Easy Operation & Customizability: Adjustable weight mixing ratio, easy to operate and control; optional vacuum degassing (0.01MPa for 3 minutes) to avoid air bubbles; curable at room or heated temperatures, fully cured in 24 hours; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness, thermal conductivity and operating time to match different diamond substrate circuit specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled thermal conductive fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and diamond substrate protection effect.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause heat accumulation and insulation gaps on diamond substrates.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto diamond substrate assemblies to ensure full coverage of circuits, chips and substrates without damaging diamond surfaces.
- Curing: Place the encapsulated diamond substrate assemblies at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and thermal matching performance.
Application Scenarios
This specialized electronic Potting Compound is widely used for Diamond Substrate Circuits in high-power electronic devices, aerospace electronic components, precision instruments, high-temperature sensors, CPU circuits and power modules. It provides reliable encapsulation, heat dissipation and protection for diamond substrates, enhancing circuit reliability, reducing overheating failure rate, extending service life, and is compatible with Rapid prototyping silicone to accelerate new diamond substrate circuit R&D, helping procurement partners reduce production costs and improve product quality. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for diamond substrate coverage); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Thermal Conductivity: Customizable; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Degassing Condition: 0.01MPa for 3 minutes; Bonding Substrates: Diamond substrates, PC, PMMA, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage); Customizable models available.
Certifications & Compliance
Our Electronic Potting Silicone complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global diamond substrate circuit production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide diamond substrate-specific tailored solutions: custom formulations (adjust thermal conductivity, dielectric properties, viscosity, hardness and curing speed), adhesion optimization for high-hardness diamond surfaces, and flexible parameter adjustment, meeting large-scale production and prototype R&D needs of different industries, adapting to various diamond substrate circuit specifications.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, adhesion, temperature resistance), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for all diamond substrate circuits?
A: Yes, it can be customized to match different diamond substrate specifications, with good compatibility with diamond surfaces and circuits.
Q: What’s the mixing ratio?
A: Customizable weight ratio, easy to operate and adjust.
Q: Will it damage diamond substrates?
A: No, it has low shrinkage and no exotherm during curing, avoiding damage to high-hardness diamond surfaces.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly, stratification during storage does not affect performance after stirring.
Shenzhen Hong Ye Jie Technology Co., Ltd
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