Product Overview
Our Electronic Potting for Inductive Coils is a professional Silicone Encapsulant developed specifically for the encapsulation, sealing and protection of inductive coils. As a leading manufacturer of electronic Potting Compound and silicone raw materials, we optimize the formula for the high temperature resistance, anti-vibration and insulation requirements of inductive coils, focusing on heat dissipation, adhesion to coil windings/metal cores and low shrinkage. Compared with ordinary potting compounds, it has better thermal conductivity, stronger adhesion to copper/aluminum windings and PCB, and can absorb internal stress caused by high-temperature operation and vibration, effectively protecting inductive coils and pins, reducing failure rates and extending service life for procurement partners.
Key Features & Advantages
- Superior Insulation & Anti-Interference: Excellent dielectric properties, ultra-strong insulation performance, effectively isolating inductive coils from external electrical and electromagnetic interference, preventing short circuits and coil breakdown, ensuring stable inductance and reliable operation, meeting the strict insulation requirements of inductive coils.
- Excellent Heat Dissipation & Temperature Adaptability: High temperature resistance (-60℃ to 220℃) and good thermal conductivity, can quickly dissipate heat generated by coil operation, operate stably in extreme temperature environments, absorb internal stress caused by high-temperature cycles, and protect coil windings and metal cores from damage.
- Strong Adhesion & Sealing: Excellent adhesion to inductive coil windings (copper, aluminum), metal cores, PCB, stainless steel, PC and PMMA, forming a tight seal, effectively achieving waterproof, moisture-proof, dust-proof and anti-corrosion effects, avoiding coil oxidation and short circuits caused by moisture.
- Anti-Vibration & Easy Operation: Two-component liquid design, high toughness after curing, strong anti-vibration performance, reducing coil damage caused by external vibration; simple mixing ratio, easy to stir evenly; supports room temperature or heat curing, full curing in 24 hours, optional vacuum degassing, improving production efficiency for batch production of inductive coils.
- High Stability & Environmental Protection: Low volatility, high strength, no harmful substances, complying with EU RoHS and international environmental standards; no stratification or performance degradation after long-term storage, compatible with coil materials, ensuring consistent product quality.
How to Use (Step-by-Step Guide)
- Pre-Mixing Preparation: Fully stir Component A to mix the settled filler evenly, and shake Component B thoroughly to ensure uniform consistency, avoiding affecting the curing effect and adhesion to inductive coil windings and metal cores.
- Mixing: Mix Component A and Component B according to the specified weight ratio (customizable), stir slowly and evenly to avoid generating air bubbles, which will affect the insulation, heat dissipation and sealing performance, and prevent damage to coil windings.
- Degassing (Optional): Put the mixed potting compound into a vacuum container, degas at 0.01MPa for 3 minutes to completely eliminate air bubbles, then it can be used for pouring.
- Curing: Pour the degassed potting compound into the inductive coil packaging mold, place it at room temperature for curing or heat to accelerate curing; after basic curing, proceed to the next process, and full curing takes 24 hours. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specialized electronic potting compound is mainly used for the encapsulation, sealing, filling and pressure protection of inductive coils. It is widely applied in high-precision electronic devices, including power supplies, automotive electronics, industrial control devices, communication equipment, consumer electronics and inverter devices. It provides reliable insulation, heat dissipation and anti-vibration protection for inductive coils, reducing failure rates caused by moisture, dust, corrosion and vibration, improving product stability, and helping procurement partners reduce production costs and enhance product competitiveness.
Technical Specifications
Type: Addition-Curing Silicone; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for inductive coil encapsulation); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Adhesion: Excellent (copper/aluminum windings, metal cores, PCB); Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated optional); Degassing Condition: 0.01MPa for 3 minutes; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage); Customizable models available.
Certifications & Compliance
Our Electronic Potting for Inductive Coils complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global inductive coil production requirements, trusted by global electronic component manufacturers and procurement partners.
Customization Options
We provide inductive coil-specific tailored solutions: custom formulations (adjust viscosity, hardness, curing speed, insulation and thermal conductivity), adhesion optimization for coil windings and metal cores, and flexible parameter adjustment, meeting small-batch customization and large-scale production needs of different electronic industries, adapting to various inductive coil specifications.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-puritysilicone raw materials screening, precision automated formulation mixing, performance testing (insulation, adhesion to coils, temperature resistance), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for all types of inductive coils?
A: Yes, it can be customized to match different inductive coil specifications, with good compatibility and adhesion to copper/aluminum windings. Q: What’s the mixing ratio?
A: Customizable weight ratio, easy to operate and adjust.
Q: Will it affect the inductance performance of the coil?
A: No, it has low dielectric loss and no impact on coil inductance, ensuring stable operation.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated optional.
Q: Shelf life?
A: 12 months when sealed and stored properly, stratification does not affect performance after stirring.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
