HONG YE SILICONE Electronic Potting for Common Mode Chokes is a specialized Electronic Potting Compound, also known as Silicone Potting Compound and Electronic Encapsulation Adhesive, tailored for common mode choke encapsulation. Crafted from high-purity Silicone raw materials, it features excellent insulation, high temperature resistance (-60℃ to 220℃), waterproof and moisture-proof performance, strong adhesion to choke windings and magnetic cores, and low volatility. It is easy to operate, cures quickly, effectively protects common mode chokes from corrosion, vibration and electromagnetic interference, complying with EU RoHS, and supporting full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting for Common Mode Chokes is a professional Silicone Encapsulant developed specifically for the encapsulation, sealing and protection of common mode chokes. As a leading manufacturer of electronic Potting Compound and silicone raw materials, we optimize the formula for the anti-interference, high insulation and anti-vibration requirements of common mode chokes, focusing on electromagnetic shielding, adhesion to windings/magnetic cores and low shrinkage. Compared with ordinary potting compounds, it has better anti-interference performance, stronger adhesion to copper windings and ferrite cores, and can absorb internal stress caused by high-temperature operation and vibration, effectively protecting common mode chokes and pins, reducing failure rates and extending service life for procurement partners.
Key Features & Advantages
- Superior Insulation & Electromagnetic Shielding: Excellent dielectric properties, ultra-strong insulation performance and effective electromagnetic shielding, effectively isolating common mode choke windings from external electrical and electromagnetic interference, preventing short circuits and coil breakdown, ensuring stable noise suppression and reliable operation, meeting the strict insulation requirements of common mode chokes.
- Wide Temperature Adaptability & Heat Dissipation: High temperature resistance (-60℃ to 220℃) and good thermal conductivity, can quickly dissipate heat generated by common mode choke operation, operate stably in extreme temperature environments, absorb internal stress caused by high-temperature cycles, and protect windings and magnetic cores from damage.
- Strong Adhesion & Sealing: Excellent adhesion to common mode choke windings (copper), ferrite magnetic cores, PCB, aluminum, stainless steel, PC and PMMA, forming a tight seal, effectively achieving waterproof, moisture-proof, dust-proof and anti-corrosion effects, avoiding winding oxidation and performance degradation caused by moisture or dust.
- Anti-Vibration & Easy Operation: Two-component liquid design, high toughness after curing, strong anti-vibration performance, reducing choke damage caused by external vibration; simple mixing ratio, easy to stir evenly; supports room temperature or heat curing, full curing in 24 hours, optional vacuum degassing, improving production efficiency for batch production of common mode chokes.
- High Stability & Environmental Protection: Low volatility, high strength, no harmful substances, complying with EU RoHS and international environmental standards; no stratification or performance degradation after long-term storage, compatible with common mode choke materials, ensuring consistent product quality and stable noise suppression performance.
How to Use (Step-by-Step Guide)
- Pre-Mixing Preparation: Fully stir Component A to mix the settled filler evenly, and shake Component B thoroughly to ensure uniform consistency, avoiding affecting the curing effect and adhesion to common mode choke windings and magnetic cores.
- Mixing: Mix Component A and Component B according to the specified weight ratio (customizable), stir slowly and evenly to avoid generating air bubbles, which will affect the insulation, heat dissipation and sealing performance, and prevent damage to delicate choke structures.
- Degassing (Optional): Put the mixed potting compound into a vacuum container, degas at 0.01MPa for 3 minutes to completely eliminate air bubbles, then it can be used for precise pouring into common mode choke molds.
- Curing: Pour the degassed potting compound into the common mode choke packaging mold, place it at room temperature for curing or heat to accelerate curing; after basic curing, proceed to the next process, and full curing takes 24 hours. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specialized electronic potting compound is mainly used for the encapsulation, sealing, filling and pressure protection of common mode chokes. It is widely applied in high-precision electronic devices, including power supplies, automotive electronics, industrial control devices, communication equipment, consumer electronics and inverter devices. It provides reliable insulation, heat dissipation and anti-vibration protection for common mode chokes, reducing failure rates caused by moisture, dust, corrosion and vibration, improving product stability, and helping procurement partners reduce production costs and enhance product competitiveness.
Technical Specifications
Type: Addition-Curing Silicone; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for common mode choke encapsulation); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Adhesion: Excellent (copper windings, ferrite cores, PCB); Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated optional); Degassing Condition: 0.01MPa for 3 minutes; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage); Customizable models available.
Certifications & Compliance
Our Electronic Potting for Common Mode Chokes complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global common mode choke production requirements, trusted by global electronic component manufacturers and procurement partners.
Customization Options
We provide common mode choke-specific tailored solutions: custom formulations (adjust viscosity, hardness, curing speed, insulation and electromagnetic shielding), adhesion optimization for choke windings and magnetic cores, and flexible parameter adjustment, meeting small-batch customization and large-scale production needs of different electronic industries, adapting to various common mode choke specifications.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, adhesion to chokes, temperature resistance), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for all types of common mode chokes?
A: Yes, it can be customized to match different common mode choke specifications, with good compatibility and adhesion to copper windings and ferrite cores.
Q: What’s the mixing ratio?
A: Customizable weight ratio, easy to operate and adjust.
Q: Will it affect the noise suppression performance of common mode chokes?
A: No, it has low dielectric loss and good electromagnetic shielding, ensuring stable noise suppression performance.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated optional.
Q: Shelf life?
A: 12 months when sealed and stored properly, stratification does not affect performance after stirring.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
