HONG YE SILICONE Electronic Potting for Glass Capacitor Dielectrics is a specialized Electronic Potting Compound, also known as Silicone Potting Compound and Electronic Encapsulation Adhesive, tailored for glass capacitor dielectric encapsulation. Crafted from high-purity Silicone raw materials, it features excellent insulation, high temperature resistance (-60℃ to 220℃), waterproof and moisture-proof performance, strong adhesion to glass dielectrics and metal electrodes, and low volatility. It is easy to operate, cures quickly, effectively protects glass capacitor dielectrics from corrosion, vibration and electrical breakdown, complying with EU RoHS, and supporting full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting for Glass Capacitor Dielectrics is a professional Silicone Encapsulant developed specifically for the encapsulation, sealing and protection of glass capacitor dielectrics. As a leading manufacturer of electronic Potting Compound and silicone raw materials, we optimize the formula for the high insulation, low dielectric loss and chemical stability requirements of glass capacitor dielectrics, focusing on insulation, heat resistance, adhesion to glass/metal and low shrinkage. Compared with ordinary potting compounds, it has better thermal stability, stronger adhesion to glass dielectrics and PCB, and can absorb internal stress caused by high-temperature cycles, effectively protecting glass capacitor dielectrics and pins, reducing failure rates and extending service life for procurement partners.
Key Features & Advantages
- Superior Insulation & Low Dielectric Loss: Excellent dielectric properties, ultra-strong insulation performance and low dielectric loss, effectively isolating glass capacitor dielectrics from external electrical interference, preventing short circuits and electrical breakdown, ensuring stable capacitance and reliable operation, meeting the strict insulation requirements of glass capacitor dielectrics.
- Wide Temperature Adaptability: High temperature resistance (-60℃ to 220℃) and excellent low-temperature performance, can operate stably in extreme temperature environments, absorb internal stress caused by high-temperature cycles, and protect glass dielectrics, metal electrodes and pins from damage or deformation.
- Strong Adhesion & Sealing: Excellent adhesion to glass capacitor dielectrics, glass substrates, metal electrodes, PCB, aluminum, copper, stainless steel, PC and PMMA, forming a tight seal, effectively achieving waterproof, moisture-proof, dust-proof and anti-corrosion effects, avoiding moisture intrusion and glass erosion.
- Low Shrinkage & Easy Operation: Two-component liquid design, low curing shrinkage, no damage to fragile glass dielectrics and electrodes; simple mixing ratio, easy to stir evenly; supports room temperature or heat curing, full curing in 24 hours, optional vacuum degassing, improving production efficiency for batch production of glass capacitors.
- High Stability & Environmental Protection: Low volatility, high strength, no harmful substances, complying with EU RoHS and international environmental standards; no stratification or performance degradation after long-term storage, compatible with glass materials and metal electrodes, ensuring consistent product quality.
How to Use (Step-by-Step Guide)
- Pre-Mixing Preparation: Fully stir Component A to mix the settled filler evenly, and shake Component B thoroughly to ensure uniform consistency, avoiding affecting the curing effect and adhesion to glass capacitor dielectrics and glass substrates.
- Mixing: Mix Component A and Component B according to the specified weight ratio (customizable), stir slowly and evenly to avoid generating air bubbles, which will affect the insulation and sealing performance, and prevent damage to fragile glass dielectrics.
- Degassing (Optional): Put the mixed potting compound into a vacuum container, degas at 0.01MPa for 3 minutes to completely eliminate air bubbles, then it can be used for pouring.
- Curing: Pour the degassed potting compound into the glass capacitor dielectric packaging mold, place it at room temperature for curing or heat to accelerate curing; after basic curing, proceed to the next process, and full curing takes 24 hours. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specialized electronic potting compound is mainly used for the encapsulation, sealing, filling and pressure protection of glass capacitor dielectrics. It is widely applied in high-precision electronic devices, including high-frequency communication equipment, industrial control devices, aerospace electronics, military equipment, test instruments and automotive electronics. It provides reliable insulation, heat dissipation and protection for glass capacitor dielectrics, reducing failure rates caused by moisture, dust, corrosion and electrical breakdown, improving product stability, and helping procurement partners reduce production costs and enhance product competitiveness.
Technical Specifications
Type: Addition-Curing Silicone; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for glass capacitor dielectric encapsulation); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Adhesion: Excellent (glass dielectrics, metal electrodes, aluminum, PCB); Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated optional); Degassing Condition: 0.01MPa for 3 minutes; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage); Customizable models available.
Certifications & Compliance
Our Electronic Potting for Glass Capacitor Dielectrics complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global glass capacitor production requirements, trusted by global electronic component manufacturers and procurement partners.
Customization Options
We provide glass capacitor dielectric-specific tailored solutions: custom formulations (adjust viscosity, hardness, curing speed, insulation and dielectric loss), adhesion optimization for glass dielectrics and metal electrodes, and flexible parameter adjustment, meeting small-batch customization and large-scale production needs of different electronic industries, adapting to various glass capacitor dielectric specifications.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, adhesion to glass, temperature resistance), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for all types of glass capacitor dielectrics?
A: Yes, it can be customized to match different glass capacitor dielectric specifications, with good compatibility and adhesion to glass substrates. Q: What’s the mixing ratio?
A: Customizable weight ratio, easy to operate and adjust.
Q: Will it damage fragile glass dielectrics or affect capacitance performance?
A: No, it has low shrinkage and no exotherm during curing, compatible with glass materials, avoiding damage and performance impact.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated optional.
Q: Shelf life?
A: 12 months when sealed and stored properly, stratification does not affect performance after stirring.
Shenzhen Hong Ye Jie Technology Co., Ltd
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