Product Overview
Our Electronic Potting for Film Capacitor Wound Cores is a professional Silicone Encapsulant developed specifically for the encapsulation, sealing and protection of film capacitor wound cores. As a leading manufacturer of electronic Potting Compound and silicone raw materials, we optimize the formula for the high insulation and low stress requirements of film capacitor wound cores, focusing on insulation, heat resistance, adhesion to film/metal and low shrinkage. Compared with ordinary potting compounds, it has better thermal stability, stronger adhesion to film layers and PCB, and can absorb internal stress caused by high-temperature cycles, effectively protecting film capacitor wound cores and pins, reducing insulation failure rates and extending service life for procurement partners.
Key Features & Advantages
- Superior Insulation & High Reliability: Excellent dielectric properties, ultra-strong insulation performance, effectively isolating film capacitor wound cores from external electrical interference, preventing short circuits and insulation breakdown, ensuring stable capacitance and reliable operation, meeting the strict insulation requirements of film capacitor wound cores.
- Wide Temperature Adaptability: High temperature resistance (-60℃ to 220℃) and excellent low-temperature performance, can operate stably in extreme temperature environments, absorb internal stress caused by high-temperature cycles, and protect film layers, wound cores and pins from damage or deformation.
- Strong Adhesion & Sealing: Excellent adhesion to film capacitor wound cores, film layers, PCB, aluminum, copper, stainless steel, PC and PMMA, forming a tight seal, effectively achieving waterproof, moisture-proof, dust-proof and anti-corrosion effects, avoiding moisture intrusion and film layer damage.
- Low Shrinkage & Easy Operation: Two-component liquid design, low curing shrinkage, no damage to delicate film wound cores; simple mixing ratio, easy to stir evenly; supports room temperature or heat curing, full curing in 24 hours, optional vacuum degassing, improving production efficiency for batch production of film capacitors.
- High Stability & Environmental Protection: Low volatility, high strength, no harmful substances, complying with EU RoHS and international environmental standards; no stratification or performance degradation after long-term storage, compatible with film capacitor materials, ensuring consistent product quality.
How to Use (Step-by-Step Guide)
- Pre-Mixing Preparation: Fully stir Component A to mix the settled filler evenly, and shake Component B thoroughly to ensure uniform consistency, avoiding affecting the curing effect and adhesion to film capacitor wound cores and film layers.
- Mixing: Mix Component A and Component B according to the specified weight ratio (customizable), stir slowly and evenly to avoid generating air bubbles, which will affect the insulation and sealing performance, and prevent damage to delicate film wound cores.
- Degassing (Optional): Put the mixed potting compound into a vacuum container, degas at 0.01MPa for 3 minutes to completely eliminate air bubbles, then it can be used for pouring.
- Curing: Pour the degassed potting compound into the film capacitor wound core packaging mold, place it at room temperature for curing or heat to accelerate curing; after basic curing, proceed to the next process, and full curing takes 24 hours. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specialized electronic potting compound is mainly used for the encapsulation, sealing, filling and pressure protection of film capacitor wound cores. It is widely applied in high-precision electronic devices, including power electronic equipment, automotive electronics, industrial control devices, communication equipment, inverter devices and consumer electronics. It provides reliable insulation, heat dissipation and protection for film capacitor wound cores, reducing failure rates caused by moisture, dust, corrosion and insulation breakdown, improving product stability, and helping procurement partners reduce production costs and enhance product competitiveness.
Technical Specifications
Type: Addition-Curing Silicone; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for film capacitor wound core encapsulation); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Adhesion: Excellent (film, aluminum, PCB, metal); Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated optional); Degassing Condition: 0.01MPa for 3 minutes; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage); Customizable models available.
Certifications & Compliance
Our Electronic Potting for Film Capacitor Wound Cores complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global film capacitor production requirements, trusted by global electronic component manufacturers and procurement partners.
Customization Options
We provide film capacitor wound core-specific tailored solutions: custom formulations (adjust viscosity, hardness, curing speed, insulation and thermal conductivity), adhesion optimization for film layers and wound cores, and flexible parameter adjustment, meeting small-batch customization and large-scale production needs of different electronic industries, adapting to various film capacitor wound core specifications.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, adhesion to film, temperature resistance), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for all types of film capacitor wound cores?
A: Yes, it can be customized to match different film capacitor wound core specifications, with good compatibility and adhesion to film layers.
Q: What’s the mixing ratio?
A: Customizable weight ratio, easy to operate and adjust.
Q: Will it damage delicate film wound cores?
A: No, it has low shrinkage and no exotherm during curing, avoiding damage to film layers and wound cores.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated optional.
Q: Shelf life?
A: 12 months when sealed and stored properly, stratification does not affect performance after stirring.
Shenzhen Hong Ye Jie Technology Co., Ltd
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