HONG YE SILICONE Electronic Potting Silicone for Ceramic Matrix Composites (CMCs) is a high-performance two-component Addition Curing Silicone, also known as Silicone Encapsulant and Electronic Potting Compound, tailored for CMCs protection. Crafted from high-puritySilicone raw materials, it features adjustable weight mixing ratio, excellent thermal conductivity, strong adhesion to CMCs substrates, and wide temperature adaptability (-60℃ to 220℃). It cures at room or heated temperatures, protects CMCs from overheating and environmental damage, ensures insulation and stability, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Silicone is specially developed for Ceramic Matrix Composites (CMCs), dedicated to encapsulating, sealing, insulating and heat-dissipating protection of CMCs substrates, circuits, chips and solder joints. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for CMCs’ high-heat generation, brittle structure and strong adhesion needs, enhancing excellent thermal conductivity, anti-vibration performance and environmental adaptability. Compared with epoxy potting resin, it has minimal volatile content, no exotherm, low shrinkage, and can absorb thermal stress to protect CMCs components and welding gold wires without damaging brittle CMCs substrates.
Key Features & Advantages
- High Thermal Conductivity & CMCs Protection: Optimized thermal conductive formula, efficiently dissipating heat generated by CMCs during high-temperature operation, avoiding overheating damage to chips and circuits; low shrinkage rate, curing without exotherm, absorbing thermal stress caused by high-temperature cycles, protecting brittle CMCs substrates and welding gold wires, ensuring long-term stable operation.
- Superior Insulation & Multi-Functional Protection: Excellent waterproof, moisture-proof, dust-proof and anti-corrosion performance; high dielectric strength and volume resistivity, ensuring reliable insulation between CMCs circuits and substrates, avoiding short circuits and signal interference; good ozone resistance and anti-chemical erosion, adapting to harsh industrial and high-temperature working environments of CMCs.
- Strong Adhesion & CMCs Compatibility: Outstanding adhesion to CMCs substrates, PC, PMMA, PCB and metals (aluminum, copper, stainless steel), tightly bonding to CMCs without peeling or damaging brittle structures; no corrosion to CMCs materials, ensuring firm and long-lasting encapsulation, reducing CMCs-based product failure rate.
- Excellent Temperature Stability: Stable performance in a wide temperature range (-60℃ to 220℃), resisting extreme temperature cycles and aging, no crystallization at low temperatures, perfectly matching CMCs’ high-temperature resistance, adapting to high-heat scenarios of CMCs in aerospace, industrial control and electronic devices.
- Easy Operation & Customizability: Adjustable weight mixing ratio, easy to operate and control; optional vacuum degassing (0.01MPa for 3 minutes) to avoid air bubbles; curable at room or heated temperatures, fully cured in 24 hours; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness, thermal conductivity and operating time to match different CMCs specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled thermal conductive fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and CMCs protection effect.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause heat accumulation and insulation gaps on CMCs.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto CMCs assemblies to ensure full coverage of circuits, chips and substrates without damaging brittle CMCs.
- Curing: Place the encapsulated CMCs assemblies at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and CMCs thermal performance.
Application Scenarios
This specialized electronic Potting Compound is widely used for Ceramic Matrix Composites (CMCs) in aerospace electronic components, industrial control systems, power modules, CPU circuits, high-temperature sensors and other electronic products. It provides reliable encapsulation, heat dissipation and protection for CMCs, enhancing CMCs-based product reliability, reducing overheating and brittle damage failure rate, extending service life, and is compatible with Rapid prototyping silicone to accelerate new CMCs product R&D, helping procurement partners reduce production costs and improve product quality. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for CMCs coverage); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Thermal Conductivity: Customizable; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Degassing Condition: 0.01MPa for 3 minutes; Bonding Substrates: CMCs, PC, PMMA, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage); Customizable models available.
Certifications & Compliance
Our Electronic Potting Silicone complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global CMCs production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide CMCs-specific tailored solutions: custom formulations (adjust thermal conductivity, dielectric properties, viscosity, hardness and curing speed), adhesion optimization for brittle CMCs substrates, and flexible parameter adjustment, meeting large-scale production and prototype R&D needs of different industries, adapting to various CMCs specifications.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, adhesion, temperature resistance), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for all Ceramic Matrix Composites?
A: Yes, it can be customized to match different CMCs specifications, with good compatibility with CMCs substrates and circuits.
Q: What’s the mixing ratio?
A: Customizable weight ratio, easy to operate and adjust.
Q: Will it damage brittle CMCs substrates?
A: No, it has low shrinkage and no exotherm during curing, avoiding damage to brittle CMCs.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly, stratification during storage does not affect performance after stirring.
Shenzhen Hong Ye Jie Technology Co., Ltd
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