Product Overview
Our Electronic Potting Silicone is specially developed for Metal Core PCBs (MCPCBs), dedicated to encapsulating, sealing, insulating and heat-dissipating protection of MCPCB substrates, circuits, chips and solder joints. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for MCPCBs’ high-heat generation, metal core structure and strong adhesion needs, enhancing excellent thermal conductivity, anti-vibration performance and environmental adaptability. Compared with epoxy potting resin, it has minimal volatile content, no exotherm, low shrinkage, and can absorb thermal stress to protect MCPCB components and welding gold wires.
Key Features & Advantages
- High Thermal Conductivity & MCPCB Protection: Optimized thermal conductive formula, efficiently dissipating heat generated by MCPCBs during operation, avoiding overheating damage to chips and circuits; low shrinkage rate, curing without exotherm, absorbing thermal stress caused by high-temperature cycles, protecting MCPCB metal cores and welding gold wires, ensuring long-term stable operation.
- Superior Insulation & Multi-Functional Protection: Excellent waterproof, moisture-proof, dust-proof and anti-corrosion performance; high dielectric strength and volume resistivity, ensuring reliable insulation between MCPCB circuits and metal cores, avoiding short circuits and signal interference; good ozone resistance and anti-chemical erosion, adapting to harsh industrial and automotive working environments.
- Strong Adhesion & Metal Compatibility: Outstanding adhesion to MCPCB metal cores (aluminum, copper, stainless steel) and PCB materials (PC, PMMA), tightly bonding to MCPCB substrates without peeling; no corrosion to metal cores, ensuring firm and long-lasting encapsulation, reducing MCPCB failure rate.
- Excellent Temperature Stability: Stable performance in a wide temperature range (-60℃ to 220℃), resisting extreme temperature cycles and aging, no crystallization at low temperatures, adapting to high-heat working scenarios of MCPCBs in automotive electronics, LEDs and industrial control.
- Easy Operation & Customizability: Adjustable weight mixing ratio, easy to operate and control; optional vacuum degassing (0.01MPa for 3 minutes) to avoid air bubbles; curable at room or heated temperatures, fully cured in 24 hours; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness, thermal conductivity and operating time to match different MCPCB specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled thermal conductive fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and MCPCB protection effect.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause heat accumulation and insulation gaps on MCPCBs.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto MCPCB assemblies to ensure full coverage of circuits, chips and metal cores.
- Curing: Place the encapsulated MCPCB assemblies at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and MCPCB thermal performance.
Application Scenarios
This specialized electronic Potting Compound is widely used for Metal Core PCBs (MCPCBs) in LEDs, automotive electronics, industrial control systems, power modules, CPU circuits and other electronic products. It provides reliable encapsulation, heat dissipation and protection for MCPCBs, enhancing MCPCB reliability, reducing overheating failure rate, extending service life, and is compatible with Rapid prototyping silicone to accelerate new MCPCB product R&D, helping procurement partners reduce production costs and improve product quality. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for MCPCB coverage); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Thermal Conductivity: Customizable; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Degassing Condition: 0.01MPa for 3 minutes; Bonding Substrates: MCPCB metal cores (aluminum, copper, stainless steel), PC, PMMA, PCB; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage); Customizable models available.
Certifications & Compliance
Our Electronic Potting Silicone complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global MCPCB production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide MCPCB-specific tailored solutions: custom formulations (adjust thermal conductivity, dielectric properties, viscosity, hardness and curing speed), adhesion optimization for different MCPCB metal cores, and flexible parameter adjustment, meeting large-scale production and prototype R&D needs of different industries, adapting to various MCPCB specifications.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, adhesion, temperature resistance), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for all Metal Core PCBs?
A: Yes, it can be customized to match different MCPCB specifications, with good compatibility with MCPCB metal cores and circuits.
Q: What’s the mixing ratio?
A: Customizable weight ratio, easy to operate and adjust.
Q: Will it corrode MCPCB metal cores?
A: No, it has good metal compatibility, no corrosion to aluminum, copper, stainless steel and other metal cores.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly, stratification during storage does not affect performance after stirring.
Shenzhen Hong Ye Jie Technology Co., Ltd
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