HONG YE SILICONE Electronic Potting Silicone for Power Quad Flat Packages (PQFP) is a high-performance two-component Addition Curing Silicone, also known as Silicone Encapsulant and Electronic Potting Compound, tailored for PQFP protection. Crafted from high-purity Silicone raw materials, it features adjustable weight mixing ratio, excellent thermal conductivity, no exotherm during curing, low shrinkage and strong adhesion. It cures at room or heated temperatures, protects high-power PQFP chips and pins from overheating and damage, ensures insulation and stability, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Silicone is specially developed for Power Quad Flat Packages (PQFP), dedicated to encapsulating, sealing, insulating and heat-dissipating protection of high-power PQFP chips, pins, PCB substrates and solder joints. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for PQFP’s high-power, high-heat generation and compact structure needs, enhancing excellent thermal conductivity, anti-vibration performance and environmental adaptability. Compared with epoxy potting resin, it has minimal volatile content, no exotherm, no corrosion, low shrinkage, and can absorb thermal stress to protect PQFP chips and welding gold wires.
Key Features & Advantages
- High Thermal Conductivity & PQFP Protection: Optimized thermal conductivity formula, efficiently dissipating heat generated by high-power PQFP during operation, avoiding overheating damage; cures without exotherm, low shrinkage rate, effectively absorbing thermal stress caused by high-temperature cycles, protecting PQFP chips and welding gold wires from damage, ensuring long-term stable operation.
- Superior Insulation & Flame Retardancy: Excellent waterproof, moisture-proof, dust-proof and anti-corrosion performance; high dielectric strength and volume resistivity, ensuring reliable insulation between PQFP pins and adjacent components, avoiding short circuits and signal interference; flame-retardant property meets industrial standards, reducing fire risks in high-power scenarios.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PCB, PC, aluminum, copper, stainless steel and PQFP chip substrates, tightly bonding PQFP to PCBs; no damage to PQFP surfaces or pins, ensuring firm and long-lasting encapsulation without peeling, reducing product failure rate.
- Excellent Temperature Stability: Stable performance in a wide temperature range (-60℃ to 220℃), resisting extreme temperature cycles and aging, no crystallization at low temperatures, adapting to high-power working environments of automotive, industrial and power electronic equipment.
- Easy Operation & Customizability: Adjustable weight mixing ratio, easy to operate and control; optional vacuum degassing (0.01MPa for 3 minutes) to avoid air bubbles; curable at room or heated temperatures, fully cured in 24 hours; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness, thermal conductivity and operating time to match different PQFP power specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled thermal conductive fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects thermal conductivity and PQFP protection effect.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause heat accumulation and insulation gaps on PQFP chips.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto PQFP assemblies to ensure full coverage of chips and pins.
- Curing: Place the encapsulated PQFP assemblies at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and PQFP thermal performance.
Application Scenarios
This specialized electronic Potting Compound is widely used for Power Quad Flat Packages (PQFP) in high-power electronic components, PCB boards, power modules, automotive electronics, industrial control systems, power supplies and other electronic products. It provides reliable encapsulation, heat dissipation and protection for PQFP, enhancing PQFP reliability, reducing overheating failure rate, extending service life, and is compatible with Rapid prototyping silicone to accelerate new PQFP product R&D, helping procurement partners reduce production costs and improve product quality. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for PQFP coverage); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Thermal Conductivity: Customizable; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Degassing Condition: 0.01MPa for 3 minutes; Bonding Substrates: PCB, PC, aluminum, copper, stainless steel, PQFP chip substrates; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage).
Certifications & Compliance
Our Electronic Potting Silicone complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global PQFP high-power production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide PQFP-specific tailored solutions: custom formulations (adjust thermal conductivity, dielectric properties, viscosity, hardness and curing speed), flame-retardant grade optimization, and flexible parameter adjustment, meeting large-scale production and prototype R&D needs of different industries, adapting to various PQFP power specifications and application scenarios.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (thermal conductivity, insulation, adhesion), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for high-power PQFP packages?
A: Yes, it has customizable thermal conductivity, effectively dissipating heat and protecting high-power PQFP chips from overheating.
Q: What’s the mixing ratio?
A: Customizable weight ratio, easy to operate and adjust.
Q: Will it damage PQFP chips or pins?
A: No, it cures without exotherm and low shrinkage, effectively protecting PQFP chips and welding gold wires.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly, stratification during storage does not affect performance after stirring.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
