HONG YE SILICONE Thermally Conductive Electronic Potting Silicone for Thick Film Hybrids (TFH) is a high-performance two-component Addition Curing Silicone, also known as Thermally Conductive Potting Compound and Silicone Encapsulant, tailored for TFH protection. Crafted from high-purity Silicone raw materials, it features a 1:1 weight mixing ratio, low viscosity, UL94-V0 flame retardancy, and ≥0.8 W/(m·K) thermal conductivity. It cures at room or heated temperatures, protects TFH circuits from overheating and environmental damage, ensures insulation and stability, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Thermally Conductive Electronic Potting Silicone is specially developed for Thick Film Hybrids (TFH), dedicated to encapsulating, sealing, insulating and heat-dissipating protection of TFH circuits, substrates and components. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for TFH’s high-density, high-heat generation and harsh working environment needs, enhancing excellent thermal conductivity, low viscosity and IP65 waterproof performance. Compared with epoxy potting resin, it has low shrinkage, cures without exotherm, forms a soft rubber after curing with good impact resistance, avoiding TFH circuit damage.
Key Features & Advantages
- High Thermal Conductivity & TFH Protection: Thermal conductivity ≥0.8 W/(m·K), efficiently dissipating heat generated by TFH during operation, avoiding overheating and circuit failure; UL94-V0 flame retardancy, reducing fire risks, fully protecting TFH circuits, substrates and components from damage.
- Superior Insulation & Waterproof Performance: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), ensuring reliable insulation of TFH circuits; IP65 waterproof grade, excellent moisture-proof and dust-proof effect, adapting to harsh outdoor and industrial environments.
- Low Viscosity & Easy Operation: Low viscosity (500±100 cps) with good leveling performance, easily filling gaps of complex TFH structures; 1:1 weight mixing ratio, simple to operate, optional vacuum degassing (0.08MPa for 5 minutes) to avoid air bubbles, improving encapsulation efficiency.
- Excellent Temperature & Environmental Stability: Stable performance in a wide temperature range (-60℃ to 220℃), resisting extreme temperature cycles and aging, extending TFH service life; good compatibility with PC, PP, ABS, PVC and metal surfaces, no corrosion to TFH components.
- Customizable & High Quality: As a professional Silicone Potting Compound manufacturer, we customize thermal conductivity, viscosity, hardness and operating time to match different TFH specifications; strict quality control ensures stable performance batch by batch, complying with EU RoHS.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A and Component B in their respective containers to ensure uniform mixing, avoiding stratification that affects thermal conductivity and TFH protection effect.
- Precision Mixing: Strictly follow the 1:1 weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles, keeping the mixed viscosity at 500±100 cps.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.08MPa for 5 minutes to eliminate air bubbles, then carefully pour it onto TFH assemblies to ensure full coverage of circuits and components.
- Curing: Cure at room temperature (4-5 hours) or heat (80℃ for 20 minutes, 80-100℃ for 15 minutes in winter); adjust curing time according to application thickness, ensuring full curing for optimal performance.
Application Scenarios
This specialized thermally conductive Potting Compound is widely used for Thick Film Hybrids (TFH) in outdoor displays, power modules, electronic modules, washing machine control boards, pulse igniters, electric bicycle drive controllers and complex electronic accessories. It provides reliable encapsulation, heat dissipation and protection for TFH, enhancing TFH reliability, reducing failure rate, extending service life, and is compatible with Rapid prototyping silicone to accelerate new TFH product R&D, helping procurement partners reduce production costs. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): 1:1 (weight ratio); Appearance: Liquid (both components); Viscosity: 500±100 cps (customizable); Hardness (Shore A): 15±5 (customizable); Operating Time: 0.5-2 hours; Curing Time: 4-5 hours (room temperature), 20 hours (80℃); Thermal Conductivity: ≥0.8 W/(m·K); Dielectric Strength: ≥25 kV/mm; Dielectric Constant (1.2MHz): 3.0～3.3; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Flame Retardancy: UL94-V0; Waterproof Grade: IP65; Compliance: EU RoHS; Shelf Life: 12 months (below 25℃); Packaging: 5kg, 20kg, 25kg, 200kg; Main Model: HY-9315 (customizable models available).
Certifications & Compliance
Our Thermally Conductive Electronic Potting Silicone complies with international standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, UL94-V0 Flame Retardant Certification, meeting global TFH production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide TFH-specific tailored solutions: custom formulations (adjust thermal conductivity, viscosity, hardness and operating time), flame-retardant grade optimization, and flexible packaging options, meeting large-scale production and prototype R&D needs of different industries, adapting to various TFH specifications.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (thermal conductivity, insulation, flame retardancy), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored below 25℃.
FAQ
Q: Is it suitable for all Thick Film Hybrids?
A: Yes, it can be customized to match different TFH specifications, with good compatibility with TFH circuits and substrates.
Q: What’s the mixing ratio?
A: 1:1 weight ratio, easy to operate.
Q: How to accelerate curing in winter?
A: Heat at 80-100℃ for 15 minutes to shorten curing time.
Q: What’s the thermal conductivity?
A: ≥0.8 W/(m·K), customizable for higher heat dissipation needs.
Q: Shelf life?
A: 12 months when sealed and stored below 25℃, non-hazardous for transportation.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
