HONG YE SILICONE Waterproof & Insulating Electronic Potting Silicone for High Temperature Cofired Ceramics (HTCC) is a high-reliability two-component RTV 2 Silicone Rubber, also known as Silicone Encapsulant and Electronic Potting Compound, tailored for HTCC protection. Crafted from high-purity Silicone raw materials, it features a 1:1 weight mixing ratio, low viscosity, UL94-V1 flame retardancy, and excellent high-temperature stability. It cures at room temperature, provides reliable waterproof and insulation protection for HTCC, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Waterproof & Insulating Electronic Potting Silicone is specially developed for High Temperature Cofired Ceramics (HTCC), dedicated to encapsulating, sealing, insulating and waterproofing protection of HTCC substrates, circuits and components. As a leading manufacturer of liquid silicone and Industrial mold silicone rubber, we optimize the formula for HTCC’s high-temperature working environment and high-insulation needs, enhancing excellent adhesion, fast room-temperature deep curing and environmental adaptability. Compared with epoxy potting resin, it has low viscosity, good fluidity, no exotherm during curing, and avoids HTCC material damage caused by thermal stress.
Key Features & Advantages
- Excellent High-Temperature & Thermal Stability: Optimized high-temperature resistant formula, adapting to HTCC’s high-temperature working scenarios, maintaining stable performance under long-term high-temperature operation, matching HTCC’s intrinsic high-temperature resistance and extending HTCC service life.
- Superior Waterproof & Insulation Performance: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), ensuring reliable insulation of HTCC circuits; excellent waterproof and sealing performance, effectively preventing moisture, dust and corrosive substances from damaging HTCC components.
- Flame Retardancy & Environmental Compliance: UL94-V1 flame retardant grade, reducing fire risks in high-temperature and electrical scenarios; fully compliant with EU RoHS Directive, non-toxic and environmentally friendly, meeting global electronic product environmental protection requirements.
- Easy Operation & Fast Curing: 1:1 weight mixing ratio, simple to operate; low viscosity (500±100 cps), good fluidity, easily filling fine gaps of HTCC structures; room-temperature curing, 3-5 minutes initial curing, 24 hours full curing, optional vacuum degassing, improving encapsulation efficiency.
- Strong Adhesion & Customizability: Excellent adhesion to PC, PP, ABS, PVC and metal surfaces, tightly bonding to HTCC substrates; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness, operating time and flame retardancy to match different HTCC specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled black pigment, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and HTCC protection effect.
- Precision Mixing: Strictly follow the 1:1 weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause insulation gaps.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.08MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto HTCC assemblies to ensure full coverage of circuits and components.
- Curing: Place the encapsulated HTCC assemblies at room temperature for curing; enter the next process after initial curing (3-5 minutes), and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specialized electronic Potting Compound is widely used for High Temperature Cofired Ceramics (HTCC) in circuit boards, electrical modules, outdoor LED displays, electronic accessories and other electronic products. It provides reliable waterproof, insulation and sealing protection for HTCC, enhancing HTCC reliability, reducing failure rate caused by moisture or short circuits, and is compatible with Rapid prototyping silicone to accelerate new HTCC product R&D, helping procurement partners reduce production costs and improve product quality. Technical Specifications
Curing Type: RTV Room-Temperature Curing; Mix Ratio (A:B): 1:1 (weight ratio); Appearance: Viscous Liquid (both components); Viscosity: 500±100 cps (customizable); Hardness (Shore A): 25±2 (customizable); Operating Time: 30～120 minutes; Curing Time: 3～5 minutes (initial), 24 hours (full); Thermal Conductivity: ≥0.2 W/(m·K); Dielectric Strength: ≥25 kV/mm; Dielectric Constant (1.2MHz): 3.0～3.3; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Flame Retardancy: UL94-V1; Compliance: EU RoHS; Shelf Life: 12 months; Packaging: 5kg, 20kg, 25kg, 200kg (iron drum); 20kg (plastic drum); Main Model: HY-9325 (customizable models available).
Certifications & Compliance
Our Waterproof & Insulating Electronic Potting Silicone complies with international standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, UL94-V1 Flame Retardant Certification, meeting global HTCC production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide HTCC-specific tailored solutions: custom formulations (adjust viscosity, hardness, operating time and flame retardant grade), adhesion optimization for different HTCC substrates, and flexible packaging options, meeting large-scale production and prototype R&D needs of different industries, adapting to various HTCC specifications.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, waterproof, flame retardancy), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for all HTCC components?
A: Yes, it can be customized to match different HTCC specifications, with good compatibility with HTCC substrates and circuits.
Q: What’s the mixing ratio?
A: 1:1 weight ratio, easy to operate.
Q: How long does it take to cure?
A: 3-5 minutes initial curing, 24 hours full curing at room temperature.
Q: How to store the product?
A: Seal and store properly, shelf life is 12 months; stratification during storage does not affect performance after stirring.
Q: Is it hazardous for transportation?
A: No, it is non-hazardous and can be transported as general chemicals.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
