Product Overview
Our Electronic Potting Silicone is specially developed for Dual Flat No-Lead Packages (DFN), dedicated to encapsulating, sealing, insulating and protecting DFN chips, PCB pads and surrounding components. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for DFN’s lead-free, compact dual-flat structure and high heat dissipation needs, enhancing excellent adhesion, anti-vibration performance and environmental adaptability. Compared with epoxy potting resin, it has minimal volatile content, no exotherm, no corrosion, low shrinkage, and can absorb thermal stress to protect DFN chips and bonding wires.
Key Features & Advantages
- Gentle Curing & DFN Protection: Cures without exotherm, no corrosion to DFN chips and PCB pads, low shrinkage rate, effectively absorbing thermal stress caused by high-temperature cycles, protecting DFN chips and welding gold wires from damage, ensuring long-term stable operation.
- Superior Insulation & Multi-Functional Protection: Excellent waterproof, moisture-proof, dust-proof and anti-corrosion performance; high dielectric strength and volume resistivity, ensuring reliable insulation between DFN and adjacent components, avoiding short circuits and signal interference; good ozone resistance and anti-chemical erosion, adapting to harsh working environments.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PCB, PC, aluminum, copper, stainless steel and DFN chip substrates, tightly bonding DFN to PCBs; no damage to DFN surfaces, ensuring firm and long-lasting encapsulation without peeling, reducing product failure rate.
- Excellent Temperature Stability: Stable performance in a wide temperature range (-60℃ to 220℃), resisting extreme temperature cycles and aging, no crystallization at low temperatures, ensuring DFN stable operation in automotive, industrial and consumer electronic working conditions.
- Easy Operation & Customizability: Adjustable weight mixing ratio, easy to operate and control; optional vacuum degassing (0.01MPa for 3 minutes) to avoid air bubbles; curable at room or heated temperatures, fully cured in 24 hours; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and operating time to match different DFN specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and DFN protection effect.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause insulation gaps or stress concentration on DFN chips.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto DFN assemblies to ensure full coverage of chips and PCB pads.
- Curing: Place the encapsulated DFN assemblies at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and DFN performance.
Application Scenarios
This specializedelectronic Potting Compound is widely used for Dual Flat No-Lead Packages (DFN) in electronic components, PCB boards, CPUs, LEDs, LCDs and other electronic products. It is suitable for automotive electronics, industrial control, consumer electronics, communication equipment and other fields, providing reliable encapsulation, sealing and protection for DFN. It enhances DFN reliability, reduces failure rate, extends service life, and is compatible with Rapid prototyping silicone to accelerate new DFN product R&D, helping procurement partners reduce production costs and improve product quality. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for DFN coverage); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Degassing Condition: 0.01MPa for 3 minutes; Bonding Substrates: PCB, PC, aluminum, copper, stainless steel, DFN chip substrates; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage).
Certifications & Compliance
Our Electronic Potting Silicone complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global DFN production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide DFN-specific tailored solutions: custom formulations (adjust dielectric properties, viscosity, hardness and curing speed), heat dissipation optimization, and flexible parameter adjustment, meeting large-scale production and prototype R&D needs of different industries, adapting to various DFN specifications and application scenarios.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, adhesion, temperature resistance), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for all DFN packages?
A: Yes, it can be customized to match different DFN specifications, with good compatibility with DFN chips and PCB pads.
Q: What’s the mixing ratio?
A: Customizable weight ratio, easy to operate and adjust.
Q: Will it damage DFN chips or bonding wires?
A: No, it cures without exotherm and low shrinkage, effectively protecting DFN chips and welding gold wires.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly, stratification during storage does not affect performance after stirring.
Shenzhen Hong Ye Jie Technology Co., Ltd
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