HONG YE SILICONE Flame-Retardant Electronic Potting Silicone for Plastic Leaded Chips (PLC) is a high-performance two-component Addition Curing Silicone, also known as Silicone Encapsulant and Electronic Potting Compound, tailored for PLC protection. Crafted from high-purity Silicone raw materials, it features a 1:1 weight mixing ratio, flame-retardant properties, no exotherm during curing, low shrinkage and strong adhesion. It cures at room or heated temperatures, protects PLC pins and chips from corrosion and fire hazards, ensures insulation and stability, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Flame-Retardant Electronic Potting Silicone is specially developed for Plastic Leaded Chips (PLC), dedicated to encapsulating, sealing, insulating and flame-retardant protection of PLC chips, plastic leads, PCB substrates and solder joints. As a leading manufacturer ofliquid silicone and addition curing silicone, we optimize the formula for PLC’s plastic lead structure and flame-retardant needs, enhancing excellent flame resistance, low curing stress and strong adhesion. Compared with epoxy potting resin, it has no exotherm, no corrosion, low shrinkage, avoiding PLC plastic lead deformation and chip damage.
Key Features & Advantages
- Excellent Flame Retardancy & PLC Protection: High-grade flame-retardant formula, effectively preventing fire spread, protecting PLC chips and plastic leads from fire hazards; cures without exotherm, low shrinkage, avoiding plastic lead deformation and chip damage, ensuring long-term stable operation of PLC.
- Superior Insulation & Environmental Adaptability: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁵ Ω), ensuring excellent insulation between PLC pins and adjacent components; waterproof, moisture-proof, mold-proof and dust-proof, resisting chemical media, yellowing and weather aging.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PCB, plastic leads, aluminum, copper and PLC chip substrates, tightly bonding PLC to PCBs; no corrosion to plastic leads or chip surfaces, ensuring firm and long-lasting encapsulation without peeling.
- Easy Operation & Flexible Curing: 1:1 weight mixing ratio, easy to operate and control; curable at room temperature or heated (80℃ for 4-5 hours), winter low temperature can be properly heated to accelerate curing; optional vacuum degassing (0.08MPa for 3 minutes) to avoid air bubbles.
- Customizable & High Quality: As a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness, operating time and curing speed to match different PLC specifications; strict quality control ensures stable product performance batch by batch.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A and Component B in their respective containers to ensure uniform mixing, avoiding stratification that affects adhesion and PLC protection effect.
- Precision Mixing: Strictly follow the 1:1 weight ratio of Component A to Component B, stirring slowly and evenly to ensure full integration without air bubbles.
- Degassing (Recommended): After mixing, place the adhesive in a vacuum container at 0.08MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto PLC assemblies to ensure full coverage of chips and leads.
- Curing: Cure at room temperature or heat to accelerate curing (80℃ for 4-5 hours); note that curing effect is greatly affected by temperature, and proper heating can accelerate vulcanization in low-temperature environments.
Application Scenarios
This specialized electronic Potting Compound is widely used for Plastic Leaded Chips (PLC) in electronic appliances, LED screens, wind power generators, PCB substrates, power modules, LED/LCD electronic displays, advertising lights and electronic circuit potting. It is ideal for bonding, sealing, potting, waterproofing and fixing PLC and non-heat-generating control modules, enhancing PLC reliability, reducing fire and failure risks, and improving environmental adaptability. It is compatible with Rapid prototyping silicone to accelerate new PLC product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): 1:1 (weight ratio); Appearance: Liquid (both components); Viscosity: 2500±500 Pa.s (customizable); Hardness (Shore A): 45±5 (customizable); Operating Time (25℃): 30-60 minutes (customizable); Curing Time (80℃): 4-5 hours; Dielectric Strength: ≥25 kV/mm; Dielectric Constant (1.2MHz): 3.0; Volume Resistivity: ≥1×10¹⁵ Ω; Flame Retardant: High-grade; Compliance: EU RoHS; Shelf Life: 12 months (below 25℃); Packaging: 5kg, 20kg, 25kg, 200kg.
Certifications & Compliance
Our Flame-Retardant Electronic Potting Silicone complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global PLC production flame-retardant and insulation requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide PLC-specific tailored solutions: custom formulations (adjust viscosity, hardness, operating time and curing speed), flame-retardant grade optimization, and flexible packaging options to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, flame-retardant and insulation performance testing, curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored below 25℃.
FAQ
Q: Is it suitable for all types of plastic leaded chips?
A: Yes, it has good compatibility with PLC plastic leads, no corrosion, and can be customized to match different PLC specifications.
Q: What’s the mixing ratio?
A: 1:1 weight ratio, easy to operate.
Q: How to handle low-temperature curing?
A: Proper heating can accelerate vulcanization in winter.
Q: What substances should be avoided during use?
A: Avoid contact with organotin compounds, sulfur, amines, incompletely cured condensation silicone, etc., which will affect curing.
Q: Can packaging be customized?
A: Yes, we provide 5kg, 20kg, 25kg, 200kg and other flexible packaging options.
Shenzhen Hong Ye Jie Technology Co., Ltd
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