HONG YE SILICONE Electronic Potting Silicone for Small Outline Integrated Circuits (SOIC) is a high-reliability two-component Addition Curing Silicone, also known as Silicone Encapsulant and Electronic Potting Compound, tailored for SOIC protection. Crafted from high-purity Silicone raw materials, it features adjustable weight mixing ratio, ultra-low curing stress, excellent temperature resistance (-60℃ to 220℃), strong adhesion and minimal volatility. It cures at room or heated temperatures, protects SOIC fine pins and chips from damage, ensures insulation and signal stability, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Silicone is specially developed for Small Outline Integrated Circuits (SOIC), dedicated to encapsulating, sealing, insulating and protecting SOIC chips, fine pins, PCB substrates and solder joints. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for SOIC’s compact structure and delicate fine pins, enhancing low curing stress, anti-vibration and excellent adhesion. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, good flexibility, avoiding SOIC pin bending, breakage and chip damage.
Key Features & Advantages
- Ultra-Low Curing Stress & SOIC Protection: Customizable low-stress formula, cures without exotherm, minimal shrinkage rate, effectively absorbing thermal and mechanical stress, protecting SOIC fine pins from bending, breakage and corrosion, ensuring long-term stable operation of SOIC assemblies.
- Superior Insulation & Anti-Interference: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), ensuring excellent insulation between SOIC fine pins and adjacent components; effectively isolating external electromagnetic interference, avoiding signal distortion and short circuits.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PCB, PC, aluminum, copper, stainless steel and SOIC chip substrates, tightly bonding SOIC to PCBs; no corrosion to pins or chip surfaces, ensuring firm and long-lasting encapsulation without peeling.
- Excellent Temperature & Environmental Stability: Stable performance from -60℃ to 220℃, resisting extreme temperature cycles and harsh environments; waterproof, moisture-proof, dust-proof, anti-corrosive and ozone-resistant, adapting to automotive, industrial and consumer electronic working conditions.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and operating time to match different SOIC pin pitches and packaging needs.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and SOIC pin stability.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause insulation gaps or stress concentration on SOIC pins.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto SOIC assemblies to ensure full coverage of pins and PCB pads without excessive pressure.
- Curing: Place the encapsulated SOIC assemblies at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and SOIC performance.
Application Scenarios
This specialized electronic Potting Compound is widely used for Small Outline Integrated Circuits (SOIC) in automotive electronics (in-vehicle control modules, sensor chips), industrial control (high-precision electronic assemblies), consumer electronics (smartphones, laptops, tablets), communication equipment and medical devices. It is ideal for encapsulating SOIC with fine pins, preventing pin damage and signal failure, ensuring stable operation in compact electronic systems. It enhances SOIC reliability, reduces failure rate, improves environmental adaptability, and is compatible with Rapid prototyping silicone to accelerate new SOIC product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for SOIC fine pin coverage); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Dielectric Loss: Low (customizable); Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PCB, PC, aluminum, copper, stainless steel, SOIC chip substrates; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage).
Certifications & Compliance
Our Electronic Potting Silicone complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global SOIC production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide SOIC-specific tailored solutions: custom formulations (adjust dielectric properties, viscosity, hardness and curing speed), anti-pin bending optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (dielectric properties, adhesion, anti-interference), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for fine-pin SOIC assemblies?
A: Yes, it has ultra-low curing stress, effectively protecting fine pins from bending and ensuring stable signal transmission.
Q: Will it affect SOIC pin conductivity?
A: No, it has stable dielectric properties, no interference with SOIC signal transmission.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for different SOIC sizes?
A: Yes, we adjust viscosity and hardness to match various SOIC pin pitches and packaging scenarios.
Shenzhen Hong Ye Jie Technology Co., Ltd
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