HONG YE SILICONE Electronic Potting Compound for Ball Grid Arrays (BGA) is a high-reliability two-component Addition Curing Silicone, also known as Silicone Encapsulant and electronic Potting Compound, tailored for BGA protection. Crafted from high-purity Silicone raw materials, it features adjustable weight mixing ratio, ultra-low curing stress, excellent temperature resistance (-60℃ to 220℃), strong adhesion and minimal volatility. It cures at room or heated temperatures, protects BGA solder balls from detachment, ensures insulation and signal stability, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Compound is specially developed for Ball Grid Arrays (BGA), dedicated to encapsulating, sealing, insulating and protecting BGA chips, solder balls, PCB pads and surrounding components. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for BGA’s high-density solder balls and fragile solder joints, enhancing low curing stress, anti-vibration and excellent adhesion. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, good flexibility, avoiding BGA solder ball detachment and signal interference.
Key Features & Advantages
- Ultra-Low Curing Stress & BGA Protection: Customizable low-stress formula, cures without exotherm, minimal shrinkage rate, effectively absorbing thermal and mechanical stress, protecting BGA solder balls from detachment and cracking, ensuring stable signal transmission of BGA assemblies.
- Superior Insulation & Anti-Interference: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), ensuring excellent insulation between BGA solder balls and adjacent components; effectively isolating external electromagnetic interference, avoiding signal distortion and short circuits.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PCB, PC, aluminum, copper, stainless steel and BGA chip substrates, tightly bonding BGA assemblies to PCBs; no corrosion to solder balls or chip surfaces, ensuring firm and long-lasting encapsulation without peeling.
- Excellent Temperature & Environmental Stability: Stable performance from -60℃ to 220℃, resisting extreme temperature cycles and harsh environments; waterproof, moisture-proof, dust-proof and anti-corrosive, adapting to automotive, industrial and high-precision electronic working conditions.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and flexibility to match different BGA specifications and packaging needs.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and BGA solder ball stability.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause insulation gaps or stress concentration on BGA solder balls.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto BGA assemblies to ensure full coverage of solder balls and PCB pads without excessive pressure.
- Curing: Place the encapsulated BGA assemblies at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and BGA performance.
Application Scenarios
This specialized electronic potting compound is widely used for Ball Grid Arrays (BGA) in automotive electronics (in-vehicle chips, engine control modules), industrial control (high-precision electronic assemblies), consumer electronics (laptops, smartphones), medical devices and communication equipment. It is ideal for encapsulating high-density BGA chips, preventing solder ball detachment and signal failure, ensuring stable operation in compact electronic systems. It enhances BGA reliability, reduces failure rate, improves environmental adaptability, and is compatible with Rapid prototyping silicone to accelerate new BGA product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for BGA coverage); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Dielectric Loss: Low (customizable); Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PCB, PC, aluminum, copper, stainless steel, BGA chip substrates; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global BGA production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide BGA-specific tailored solutions: custom formulations (adjust dielectric properties, viscosity, hardness and curing speed), anti-solder detachment optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (dielectric properties, adhesion, anti-interference), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for high-density BGA assemblies?
A: Yes, it has ultra-low curing stress, effectively protecting BGA solder balls from detachment and ensuring stable signal transmission.
Q: Will it affect BGA solder joint conductivity?
A: No, it has stable dielectric properties, no interference with BGA signal transmission.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for different BGA sizes?
A: Yes, we adjust viscosity and hardness to match various BGA specifications and packaging scenarios.
Shenzhen Hong Ye Jie Technology Co., Ltd
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