HONG YE SILICONE Electronic Potting Compound for Chip-on-Board (COB) Assemblies is a high-reliability two-component Addition Curing Silicone, also known as Silicone Encapsulant and electronic Potting Compound, tailored for COB protection. Crafted from high-purity Silicone raw materials, it features adjustable weight mixing ratio, ultra-low curing stress, excellent temperature resistance (-60℃ to 220℃), strong adhesion and minimal volatility. It cures at room or heated temperatures, protects COB chips and bonding points from damage, ensures insulation and stability, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Compound is specially developed for Chip-on-Board (COB) Assemblies, dedicated to encapsulating, sealing, insulating and protecting COB chips, bonding wires, PCB substrates and solder joints. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for COB’s chip-direct-mount structure and fragile bonding points, enhancing low curing stress, anti-vibration and excellent adhesion. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, good flexibility, avoiding COB chip damage and bonding wire detachment.
Key Features & Advantages
- Ultra-Low Curing Stress & COB Protection: Customizable low-stress formula, cures without exotherm, minimal shrinkage rate, effectively absorbing thermal and mechanical stress, protecting COB chips, bonding wires and solder joints from damage, ensuring long-term stability of COB assemblies.
- Superior Insulation & Anti-Interference: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), ensuring excellent insulation between COB chips and adjacent components; effectively isolating external electromagnetic interference, avoiding signal distortion and short circuits.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PCB, PC, aluminum, copper, stainless steel and COB chip substrates, tightly bonding COB chips to PCBs; no corrosion to chip surfaces or bonding wires, ensuring firm and long-lasting encapsulation without peeling.
- Excellent Temperature & Environmental Stability: Stable performance from -60℃ to 220℃, resisting extreme temperature cycles and harsh environments; waterproof, moisture-proof, dust-proof and anti-corrosive, adapting to automotive, industrial, LED and high-precision electronic working conditions.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and flexibility to match different COB assembly specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and COB assembly stability.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause insulation gaps or stress concentration on COB chips.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto COB assemblies to ensure full coverage of chips, bonding wires and solder joints without excessive pressure.
- Curing: Place the encapsulated COB assemblies at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and COB performance.
Application Scenarios
This specialized electronic potting compound is widely used for Chip-on-Board (COB) Assemblies in automotive electronics (in-vehicle LED modules, control chips), industrial control (high-precision electronic assemblies), LED lighting (COB LED bulbs, panels), consumer electronics and communication equipment. It is ideal for encapsulating COB chips, preventing chip damage and bonding wire detachment, ensuring stable operation in compact, high-density electronic systems. It enhances COB reliability, reduces failure rate, improves environmental adaptability, and is compatible with Rapid prototyping silicone to accelerate new COB product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for COB coverage); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Dielectric Loss: Low (customizable); Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PCB, PC, aluminum, copper, stainless steel, COB chip substrates; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global COB assembly production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide COB-specific tailored solutions: custom formulations (adjust dielectric properties, viscosity, hardness and curing speed), anti-chip damage optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (dielectric properties, adhesion, anti-interference), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for high-density COB assemblies?
A: Yes, it has ultra-low curing stress, effectively protecting COB chips and bonding wires from damage and ensuring stable operation.
Q: Will it affect COB chip performance?
A: No, it has stable dielectric properties, no interference with COB signal transmission or chip function.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for different COB sizes?
A: Yes, we adjust viscosity and hardness to match various COB assembly specifications.
Shenzhen Hong Ye Jie Technology Co., Ltd
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