Product Overview
Our Electronic Potting Compound is specially developed for Wire Bond Interconnects, dedicated to encapsulating, sealing, insulating and protecting wire bonds (gold, aluminum wires), chips, solder joints and PCB-mounted areas. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for the fragility of wire bonds and high signal stability needs, enhancing low curing stress, anti-vibration and excellent adhesion. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, good flexibility, avoiding wire bond breakage and signal interference.
Key Features & Advantages
- Ultra-Low Curing Stress & Wire Bond Protection: Customizable low-stress formula, cures without exotherm, minimal shrinkage rate, effectively absorbing thermal and mechanical stress, protecting fragile wire bonds (gold/aluminum wires) from breakage, ensuring stable signal transmission of interconnects.
- Superior Insulation & Anti-Interference: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), ensuring excellent insulation between wire bonds and adjacent components; effectively isolating external electromagnetic interference, avoiding signal distortion caused by interference.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PCB, PC, aluminum, copper, stainless steel and chip substrates, tightly bonding wire bond interconnects to PCBs and chips; no corrosion to metal wires or chip surfaces, ensuring firm and long-lasting encapsulation without peeling.
- Excellent Temperature & Environmental Stability: Stable performance from -60℃ to 220℃, resisting extreme temperature cycles and harsh environments; waterproof, moisture-proof, dust-proof and anti-corrosive, adapting to automotive, industrial and high-precision electronic working conditions.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and flexibility to match different wire bond interconnect specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and wire bond stability.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause insulation gaps or stress concentration on wire bonds.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto wire bond interconnects to ensure full coverage of wires and solder joints without excessive pressure.
- Curing: Place the encapsulated wire bond interconnects at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and wire bond performance.
Application Scenarios
This specialized electronic potting compound is widely used for Wire Bond Interconnects in automotive electronics (in-vehicle chips, sensor modules), industrial control (high-precision electronic assemblies), consumer electronics (smartphones, microchips), medical devices and communication equipment. It is ideal for encapsulating fragile wire bonds, preventing breakage and signal distortion, ensuring stable operation in high-precision electronic systems. It enhances interconnect reliability, reduces failure rate, improves environmental adaptability, and is compatible with Rapid prototyping silicone to accelerate new electronic product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for wire bond coverage); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Dielectric Loss: Low (customizable); Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PCB, PC, aluminum, copper, stainless steel, chip substrates; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global wire bond interconnect production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide wire bond interconnect-specific tailored solutions: custom formulations (adjust dielectric properties, viscosity, hardness and curing speed), anti-breakage optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (dielectric properties, adhesion, anti-interference), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for fragile wire bond interconnects?
A: Yes, it has ultra-low curing stress, effectively protecting wire bonds from breakage and ensuring stable signal transmission.
Q: Will it affect wire bond conductivity?
A: No, it has stable dielectric properties, no interference with wire bond signal transmission.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for different wire bond types?
A: Yes, we adjust viscosity and hardness to match various wire bond interconnect specifications.
Shenzhen Hong Ye Jie Technology Co., Ltd
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