HONG YE SILICONE Electronic Potting Compound for Multilayer Ceramic Capacitors (MLCC) is a high-reliability two-component Addition Curing Silicone, also known as Silicone Encapsulant andelectronic Potting Compound, tailored for MLCC protection. Crafted from high-purity Silicone raw materials, it features adjustable weight mixing ratio, ultra-low curing stress, excellent temperature resistance (-60℃ to 220℃), strong adhesion and minimal volatility. It cures at room or heated temperatures, prevents MLCC cracking, ensures insulation and stability, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Compound is specially developed for Multilayer Ceramic Capacitors (MLCC), dedicated to encapsulating, sealing, insulating and protecting MLCCs, their solder joints and PCB-mounted areas. As a leading manufacturer ofliquid silicone and addition curing silicone, we optimize the formula for MLCC’s brittle structure and high capacitance stability needs, enhancing low curing stress, high insulation and excellent adhesion. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, good flexibility, avoiding MLCC cracking and capacitance drift.
Key Features & Advantages
- Ultra-Low Curing Stress & Anti-Cracking: Customizable low-stress formula, cures without exotherm, minimal shrinkage rate, effectively absorbing thermal and mechanical stress, preventing MLCC chips from cracking (a common issue with brittle ceramic materials) and ensuring long-term structural integrity.
- Superior Insulation & Capacitance Stability: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), ensuring excellent insulation between MLCC electrodes and adjacent components; no interference with MLCC capacitance performance, avoiding capacitance drift caused by external factors.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PCB, PC, aluminum, copper, stainless steel and ceramic substrates, tightly bonding MLCCs to PCBs; no corrosion to MLCC electrodes or ceramic materials, ensuring firm and long-lasting encapsulation without peeling.
- Excellent Temperature & Environmental Stability: Stable performance from -60℃ to 220℃, resisting extreme temperature cycles and harsh environments; waterproof, moisture-proof, dust-proof and anti-corrosive, adapting to automotive, industrial and consumer electronics working conditions.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and flexibility to match different MLCC sizes and mounting scenarios.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and MLCC stability.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause insulation gaps or stress concentration on MLCCs.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto MLCCs to ensure full coverage of capacitors and solder joints without excessive pressure.
- Curing: Place the encapsulated MLCCs at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and MLCC performance.
Application Scenarios
This specialized electronic potting compound is widely used for Multilayer Ceramic Capacitors (MLCC) in automotive electronics (in-vehicle control modules, infotainment systems), industrial control (power supplies, sensor modules), consumer electronics (smartphones, laptops), medical devices and communication equipment. It is ideal for encapsulating MLCCs of all sizes, preventing cracking and capacitance drift, ensuring stable operation in compact, high-density electronic assemblies. It enhances MLCC reliability, reduces failure rate, improves environmental adaptability, and is compatible with Rapid prototyping silicone to accelerate new electronic product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for MLCC coverage); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PCB, PC, aluminum, copper, stainless steel, ceramic; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global MLCC production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide MLCC-specific tailored solutions: custom formulations (adjust curing stress, viscosity, hardness and curing speed), anti-cracking optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (curing stress, adhesion, insulation), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for fragile MLCCs?
A: Yes, it has ultra-low curing stress, effectively preventing MLCC cracking and protecting brittle ceramic components.
Q: Will it affect MLCC capacitance?
A: No, it has stable dielectric properties, no interference with MLCC capacitance output.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for different MLCC sizes?
A: Yes, we adjust viscosity and hardness to match various MLCC specifications and mounting needs.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
