HONG YE SILICONE Electronic Potting Compound for Rigid-Flex Circuits is a high-performance two-componentAddition Curing Silicone, also known as Silicone Encapsulant and electronic Potting Compound, tailored for rigid-flex circuit protection. Crafted from high-purity Silicone raw materials, it features adjustable weight mixing ratio, excellent flexibility, temperature resistance (-60℃ to 220℃), strong adhesion and low shrinkage. It cures at room or heated temperatures, adapts to circuit bending, ensures waterproof insulation, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Compound is specially developed for Rigid-Flex Circuits, dedicated to encapsulating, sealing, insulating and protecting rigid-flex circuit boards, solder joints, and interconnections. As a leading manufacturer ofliquid silicone and addition curing silicone, we optimize the formula for the flexible and rigid dual structure of rigid-flex circuits, enhancing flexibility, low curing stress and excellent adhesion. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, good flexibility, avoiding cracking when circuits bend and ensuring stable circuit operation.
Key Features & Advantages
- Excellent Flexibility & Bend Adaptability: Customizable flexible formula, maintaining elasticity after curing, perfectly adapting to the bending and folding characteristics of rigid-flex circuits, no cracking or peeling even after repeated bending, protecting circuit integrity.
- Low Curing Stress & No Exotherm: Cures without exotherm, low shrinkage rate, minimal curing stress, avoiding damage to fragile rigid-flex circuit solder joints and interconnections, ensuring the structural stability of both rigid and flexible sections.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to rigid PCB, flexible circuit substrates, PC, aluminum, copper and stainless steel, tightly bonding all parts of rigid-flex circuits; no corrosion to circuit lines, ensuring firm and long-lasting encapsulation.
- Superior Insulation & Environmental Protection: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), ensuring excellent insulation between circuit lines; waterproof, moisture-proof, dust-proof and anti-corrosive, resisting ozone and chemical erosion, adapting to harsh working environments.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and flexibility to match different rigid-flex circuit specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects adhesion and flexibility of rigid-flex circuits.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause circuit short circuits or poor insulation.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto rigid-flex circuits to ensure full coverage of rigid and flexible sections.
- Curing: Place the encapsulated rigid-flex circuits at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and flexibility.
Application Scenarios
This specialized electronic potting compound is widely used for Rigid-Flex Circuits, including consumer electronics (smartphones, wearables), automotive electronics, medical devices, industrial control and aerospace equipment. It is ideal for encapsulating rigid-flex circuit boards that require bending and folding, ensuring stable operation in compact, dynamic devices. It enhances circuit reliability, reduces failure rate, improves environmental adaptability, and is compatible with Rapid prototyping silicone to accelerate new rigid-flex circuit product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (suitable for circuit coverage); Hardness (Shore A): Customizable (flexible grade); Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: Rigid PCB, flexible circuits, PC, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global rigid-flex circuit production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide rigid-flex circuit-specific tailored solutions: custom formulations (adjust flexibility, viscosity, hardness and curing speed), low-stress optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (flexibility, adhesion, insulation), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for bendable rigid-flex circuits?
A: Yes, it has excellent flexibility, no cracking after repeated bending, perfectly adapting to rigid-flex circuit characteristics.
Q: Will it damage circuit lines?
A: No, it has no exotherm and low shrinkage, no corrosion to circuit lines or solder joints.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for specific rigid-flex circuits?
A: Yes, we adjust flexibility and viscosity to match different circuit specifications.
Shenzhen Hong Ye Jie Technology Co., Ltd
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