Product Overview
Our Electronic Potting Compound is specially developed for Flip-Chip Assemblies, dedicated to encapsulating, sealing, flame-retarding and protecting flip-chip solder bumps, circuits and delicate components. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for flip-chip’s precision structure, enhancing low curing stress, high flame retardancy and excellent adhesion. Compared with epoxy potting resin, it has no exotherm, minimal shrinkage, good flexibility, avoiding damage to fragile solder bumps and ensuring stable flip-chip assembly operation in harsh environments.
Key Features & Advantages
- Excellent Flame Retardancy: High-grade flame-retardant formula, effectively inhibiting combustion, meeting international flame-retardant standards, protecting flip-chip assemblies from fire hazards, suitable for high-safety electronic applications.
- Low Curing Stress & No Exotherm: Cures without exotherm, low shrinkage rate, effectively reducing stress on flip-chip solder bumps and delicate components, avoiding solder joint detachment or chip damage, ensuring assembly structural stability.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PCB substrates, flip-chip surfaces, aluminum, copper and stainless steel, tightly bonding components, preventing moisture and dust intrusion; no corrosion to flip-chip circuits and solder bumps.
- Superior Insulation & Environmental Adaptability: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁵ Ω), ensuring excellent insulation between flip-chip circuits; waterproof, moisture-proof, mold-proof and dust-proof, resisting chemical media and climate aging.
- Easy Operation & Customizability: 1:1 weight mixing ratio, easy to operate; optional vacuum degassing (0.08MPa for 3 minutes), curable at room or heated temperatures (80℃ for 4-5 hours); as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and operation time to match different flip-chip assembly specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A and Component B in their respective containers to ensure uniformity, avoiding stratification that affects flame retardancy and adhesion to flip-chip assemblies.
- Precision Mixing: Strictly follow the 1:1 weight ratio of Component A to Component B, stirring slowly and evenly to ensure full integration without air bubbles that cause circuit short circuits or solder bump damage.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.08MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto flip-chip assemblies to ensure full coverage of solder bumps and circuits.
- Curing: Cure at room temperature or heat to 80℃ for 4-5 hours to accelerate curing; note that curing effect is greatly affected by temperature, and proper heating can be used to speed up vulcanization in low-temperature environments.
Application Scenarios
This specialized electronic potting compound is widely used for Flip-Chip Assemblies, including high-precision electronic components, LED screens, power modules, PCB substrates, wind energy motors and LCD electronic displays. It is suitable for industries such as consumer electronics, automotive electronics, industrial control and new energy, ensuring stable operation of flip-chip assemblies in high-safety, harsh environments. It enhances assembly reliability, reduces failure rate, improves flame-retardant safety, and is compatible with Rapid prototyping silicone to accelerate new flip-chip product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): 1:1 (weight ratio); Appearance: Liquid (both components); Viscosity: 2500±500 Pa.s (customizable); Hardness (Shore A): 45±5 (customizable); Operation Time (25℃): 30-60 minutes (customizable); Curing Time: 24 hours (room temperature), 4-5 hours (80℃); Dielectric Strength: ≥25 kV/mm; Dielectric Constant (1.2MHz): 3.0; Volume Resistivity: ≥1×10¹⁵ Ω; Flame Retardant: High-grade; Compliance: EU RoHS; Shelf Life: 12 months (below 25℃); Packaging: 5kg, 20kg, 25kg, 200kg. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic safety, flame-retardant and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global flip-chip assembly production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide flip-chip assembly-specific tailored solutions: custom formulations (adjust viscosity, hardness, operation time and flame-retardant grade), low-stress optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (flame retardancy, adhesion, curing stress), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored below 25℃.
FAQ
Q: Is it suitable for flip-chip solder bump protection?
A: Yes, it has low curing stress and no exotherm, avoiding damage to fragile solder bumps.
Q: What’s the mixing ratio?
A: 1:1 weight ratio, easy to operate.
Q: Can it be cured at room temperature?
A: Yes, it can be cured at room temperature (24 hours) or heated to accelerate curing.
Q: What’s the shelf life?
A: 12 months when stored below 25℃ in sealed condition.
Q: Are there any substances that affect curing?
A: Avoid contact with organotin compounds, sulfur, amines and other substances, which will prevent curing.
Shenzhen Hong Ye Jie Technology Co., Ltd
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