HONG YE SILICONE Electronic Potting Compound for Wafer-Level Packaging (WLP) is a high-performance two-component liquid silicone (conductive type), also known as Silicone Encapsulant and electronic Potting Compound, tailored for WLP protection. Crafted from high-purity Silicone raw materials, it features 1:1 weight mixing ratio, excellent thermal conductivity (≥0.8 W/(m·k)), high insulation, fast curing speed, and low shrinkage. It cures at room or heated temperatures, protects wafer-level components, ensures waterproofing and heat dissipation, complies with EU RoHS and UL94-V1, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Compound is specially developed for Wafer-Level Packaging (WLP), dedicated to encapsulating, sealing, thermally conducting and insulating precision wafer-level components, chips and bonding pads. As a leading manufacturer of liquid silicone and Addition Curing Silicone, we optimize the formula for WLP’s ultra-precise structure, enhancing low curing stress, high thermal conductivity and excellent adhesion. Compared with epoxy potting resin, it cures without exotherm, has minimal shrinkage and good flexibility, avoiding damage to delicate wafer components and ensuring stable heat dissipation and insulation performance.
Key Features & Advantages
- Excellent Thermal Conductivity & Insulation: Thermal conductivity ≥0.8 W/(m·k), effectively dissipating heat generated by wafer-level components during operation; high dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), ensuring superior insulation, avoiding short circuits and signal interference.
- Low Curing Stress & No Exotherm: Cures without exotherm, low shrinkage rate, minimal curing stress, protecting delicate wafer bonding pads and components from damage, ensuring the structural integrity of wafer-level packaging.
- Fast Curing & Easy Operation: Fast curing speed, 30-60 minutes operation time at 25℃, 4-5 hours curing at room temperature or 20 minutes at 80℃; 1:1 weight mixing ratio, easy to operate, improving production efficiency for WLP mass production.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to wafer substrates, PCB, aluminum, copper and stainless steel, tightly bonding components, preventing moisture, dust and chemical media intrusion; no corrosion to delicate wafer parts, ensuring long-lasting protection.
- Flame Retardant & Customizable: UL94-V1 flame retardant grade, effectively inhibiting combustion, ensuring WLP safety; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness, curing speed and thermal conductivity to match different WLP specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A (dark gray fluid) and Component B (white fluid) in their respective containers to ensure uniformity, avoiding stratification that affects thermal conductivity and adhesion to wafer-level components.
- Precision Mixing: Strictly follow the 1:1 weight ratio of Component A to Component B, stirring slowly and evenly to ensure full integration without air bubbles that cause heat accumulation or insulation failure.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.08MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto wafer-level packaging to ensure full coverage of components and bonding pads.
- Curing: Cure at room temperature (4-5 hours) or heat to 80℃ for 20 minutes to accelerate curing; note that curing effect is greatly affected by temperature, and proper heating can speed up vulcanization in low-temperature environments.
Application Scenarios
This specialized electronic potting compound is widely used for Wafer-Level Packaging (WLP), including consumer electronics (smartphones, wearables), automotive electronics, LED components, power modules and communication devices. It is ideal for encapsulating wafer-level chips, bonding pads and precision electronic components, ensuring stable heat dissipation and insulation in compact WLP modules. It enhances WLP reliability, reduces component failure rate, improves production efficiency, and is compatible with Rapid prototyping silicone to accelerate new WLP product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): 1:1 (weight ratio); Appearance: Component A (dark gray fluid), Component B (white fluid); Viscosity: 3000±500 mPa·s (customizable); Hardness (Shore A): 55±5 (customizable); Operation Time (25℃): 30-60 minutes; Curing Time: 4-5 hours (25℃), 20 minutes (80℃); Thermal Conductivity: ≥0.8 W/(m·k); Dielectric Strength: ≥25 kV/mm; Dielectric Constant (1.2MHz): 3.0-3.3; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Flame Retardancy: UL94-V1; Compliance: EU RoHS; Shelf Life: 12 months; Packaging: 5kg, 20kg, 25kg, 200kg. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic safety, flame-retardant and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, UL94-V1 Flame Retardant Standard, meeting global wafer-level packaging production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide WLP-specific tailored solutions: custom formulations (adjust viscosity, hardness, curing speed and thermal conductivity), low-stress optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (thermal conductivity, adhesion, flame retardancy), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for precision wafer-level packaging components?
A: Yes, it has low curing stress and no exotherm, avoiding damage to delicate wafer bonding pads and components.
Q: What’s the mixing ratio?
A: 1:1 weight ratio, easy to operate and control.
Q: How fast can it cure?
A: 4-5 hours at room temperature, 20 minutes at 80℃, improving production efficiency.
Q: What’s the thermal conductivity?
A: ≥0.8 W/(m·k), effectively dissipating wafer heat.
Q: Can it be customized for specific WLP needs?
A: Yes, we adjust thermal conductivity, viscosity and hardness to match different WLP specifications.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
