Product Overview
Our Electronic Potting Compound is specially developed for System-in-Package (SiP) Designs, dedicated to encapsulating, sealing, insulating and protecting high-density integrated SiP modules, including chips, passive components and interconnections. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for SiP’s compact, multi-component structure, enhancing fine gap penetration, low signal interference and thermal stability. Compared with epoxy potting resin, it has minimal volatility, no exotherm during curing, good flexibility, avoiding damage to delicate SiP components and ensuring stable operation in compact electronic devices.
Key Features & Advantages
- Excellent Gap Penetration for High-Density SiP: Customizable low viscosity formula, excellent fluidity, easily filling tiny gaps between SiP components, interconnections and substrates, ensuring full encapsulation without dead corners,适配 SiP’s high-integration layout.
- Superior Thermal Stability & Stress Absorption: Stable performance from -60℃ to 220℃, effectively dissipating heat generated by multi-component SiP modules; absorbs thermal stress caused by high-temperature cycles, protecting chips, welding gold wires and passive components from damage, extending SiP service life.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PC, PCB, aluminum, copper and stainless steel, tightly bonding SiP components and substrates; no corrosion to delicate electronic parts, ensuring firm and long-lasting encapsulation without peeling or detachment.
- Low Interference & High Insulation: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), isolating adjacent SiP components and circuits, avoiding signal crosstalk and electromagnetic interference, ensuring stable SiP performance.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and curing speed to match different SiP design specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects gap penetration and adhesion to SiP components.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause short circuits or signal interference in SiP modules.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto SiP designs to ensure full infiltration of tiny gaps between components.
- Curing: Place the encapsulated SiP modules at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and bonding performance.
Application Scenarios
This specialized electronic potting compound is widely used for System-in-Package (SiP) Designs, including consumer electronics (smartphones, wearables), automotive electronics, industrial control modules, medical devices and communication equipment. It is ideal for encapsulating high-density SiP modules with chips, resistors, capacitors and interconnections, ensuring stable operation in compact, high-performance devices. It enhances SiP reliability, reduces component failure rate, improves integration stability, and is compatible with Rapid prototyping silicone to accelerate new SiP product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (low for fine gaps); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global System-in-Package design production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide SiP-specific tailored solutions: custom formulations (adjust viscosity for fine gaps, insulation and curing speed), anti-interference optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (viscosity, adhesion, thermal stability), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for high-density SiP modules with tiny gaps?
A: Yes, it has low viscosity and excellent gap penetration, adapting to SiP’s compact component layout.
Q: Will it damage delicate SiP components?
A: No, it has no exotherm and low shrinkage, avoiding damage to chips and interconnections.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for specific SiP designs?
A: Yes, we adjust viscosity and hardness to match different SiP integration densities and specifications.
Shenzhen Hong Ye Jie Technology Co., Ltd
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